tag: Brewer Science

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science
By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 07 Sep, 2018 - Comments: 0

Packaging Brewer Science has introduced the latest additions to its family of temporary bonding materials. The company also rolled out its new line of thin spin-on packaging materials. The company’s temporary bonding materials are called BrewerBOND. The new products, called the BrewerBOND T1100 and BrewerBOND C1300 series, are combine to create a dual-layer system for temporary bonding a... » read more

Big Shifts In Tech Conferences
By Ed Sperling - 16 Aug, 2018 - Comments: 0

By Ed Sperling and Katherine Derbyshire Identifying central themes in technology conferences, or finding enough latitude where the theme is extremely well defined, is becoming challenging throughout the tech industry. Throughout the semiconductor industry, in particular, many are asking how various organizations will differentiate conferences in the future and who will be the target audience... » read more

Where FD-SOI Works Best (Part 2)
By Ed Sperling - 15 Aug, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Return Of The Organic Interposer
By Ed Sperling - 06 Aug, 2018 - Comments: 2

Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means of reducing costs in 2.5D multi-die configurations. There are several reasons why there is a renewed interest in this technology: More companies are pushing up against the limits of Moore's Law, where the cost of continuing to shrinking features is exorbitant. ... » read more

Printed Electronics Materials
By Ed Sperling - 06 Aug, 2018 - Comments: 0

Brewer Science’s Dominic Miranda digs into printed electronics, why they’re becoming so important, what materials should be used, and how they can be targeted for specific applications in sensors and edge devices. https://youtu.be/tN2goxrDCqA » read more

The Next Generation Of Fingerprinting Technology
By Yongqing Jiang - 06 Aug, 2018 - Comments: 0

We used to think of fingerprinting as simply placing your finger on an ink pad and then rolling it on paper to obtain an identifiable mark that would distinguish you from everyone else on the planet. In today’s world, fingerprinting has evolved to take on another, broader definition. According to dictionary.com, fingerprinting can also mean “any unique or distinctive pattern that presents u... » read more

Mixed Outlook For Semi Biz
By Mark LaPedus - 25 Jul, 2018 - Comments: 0

Both the IC and fab equipment industries have been enjoying a boom cycle for some time, but they could be facing speed bumps and possibly turbulence in the second half of this year and into 2019. In the first half of 2018, the industry was fueled by the momentum carried over from 2017. DRAM prices remained relatively high, which contributed to the revenue growth in the overall IC industry. M... » read more

FD-SOI Going Mainstream
By Ed Sperling - 19 Jul, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Prepare For Success With A Failure Mode And Effects Analysis And Control Plan
By Tim Limmer - 12 Jul, 2018 - Comments: 0

In order to proactively handle potential process or product errors before they occur in manufacturing or on a customer’s production line, many organizations implement a Failure Mode and Effects Analysis (FMEA) and Control Plan (CP). Used as a process tool by the US military as early as 1949, FMEAs and CPs have evolved and gained popularity in many industries ranging from automotive, to pharma... » read more

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