Week In Review: Design, Low Power


Tools, IP, design Infineon Technologies acquired NoBug, a provider of design verification services. The acquisition will help Infineon expand its IoT R&D business in eastern Europe. “This considerable increase in superior verification know-how lets Infineon offer its customers more of its leading products at a reduced time-to-market,” said Guenter Krasser, Vice President and Managing D... » read more

Week In Review: Design, Low Power


RISC-V RISC-V International announced four new specification and extension approvals. Efficient Trace for RISC-V defines an approach to processor tracing that uses a branch trace. RISC-V Supervisor Binary Interface architects a firmware layer between the hardware platform and the operating system kernel using an application binary interface in supervisor mode to enable common platform services... » read more

Week In Review: Design, Low Power


Siemens Digital Industries Software acquired Nextflow Software, a provider of advanced particle-based computational fluid dynamics (CFD) solutions. Nextflow Software will become part of the Simcenter software portfolio, providing rapid meshless CFD capabilities to accelerate the analysis of complex transient applications in the automotive, aerospace, and marine industries such as gear box lubri... » read more

Startup Funding: August 2020


Semiconductor startups were hot this month, with big funding going to designers and chip analytics. In automotive, one Chinese electric vehicle company raised another large round right before its IPO, and a LiDar maker's reverse merger gave it a cash infusion and set it on its own IPO road. Plus, a growing quantum computer developer saw a funding boost. This month, we feature 17 startups that c... » read more

Week In Review: Design, Low Power


M&A SMIT Holdings acquired S2C, a provider of FPGA prototyping hardware and software as well as interfaces and accessories, for $19 million, plus up to US$2 million in milestone based payments to the key management team. S2C was founded in 2003. SMIT, based in Hong Kong, makes pay TV broadcasting access and mobile point-of-sale payment systems for the Chinese market. Tools & IP Syn... » read more

The Week In Review: Design


Startup OnScale launched with advanced CAE multi-physics solvers that are seamlessly integrated with a scalable, high performance cloud computing platform built on Amazon's AWS. The company's model is built around a Solver-as-a-Service pay-as-you-go subscription model and targets 5G, IoT/Industrial IoT, biomedical, and autonomous car markets. The company has $3 million in strategic seed fund... » read more

The Week In Review: Design


M&A Synopsys acquired materials modeling company QuantumWise. QuantumWise tools focus on atomic-scale modeling of nanostructures using quantum-mechanical computational methods, classical potentials, and electrostatic models. Based in Denmark, the company was started in 2008 when it acquired the assets of Atomistix. The technology will be integrated with Synopsys' Sentaurus TCAD. Terms of t... » read more

The Week In Review: IoT


Finance Santa Monica, Calif.-based Sixgill reports raising $27.9 million in its Series B round of private financing, led by DRW Venture Capital. Mobile Financial Partners participated in the round. The startup last year raised $6 million in its Series A funding, also led by DRW. The company offers the Sixgill Sense sensor data services platform, addressing applications in the Internet of Thing... » read more

The Week In Review: Design


M&A Siemens plans to buy Mentor Graphics for $4.5 billion in cash. The move, if approved by regulators, would greatly expand Siemens’ capabilities in multi-physics design and embedded software for everything from semiconductors to automotive wiring harnesses. The transaction is expected to close in the second quarter of 2017. Tools Mentor Graphics uncorked a new product to measur... » read more

Foundries Expand Their Scope


By Ed Sperling & Mark LaPedus Major foundries are stepping up their offerings across a wide swath of technology nodes, specialty processes and advanced packaging—a recognition that end markets are fragmenting and that the path forward includes a mix of new and established processes. As the smart phone market flattens, there is no single "next big thing" to drive volume at the most ... » read more

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