Hybrid Photoresist Capable Of High-Resolution, Positive-Tone EUVL Patterning


A technical paper titled “Vapor-Phase Infiltrated Organic–Inorganic Positive-Tone Hybrid Photoresist for Extreme UV Lithography” was published by researchers at Stony Brook University, Brookhaven National Laboratory, and University of Texas at Dallas. Abstract: "Continuing extreme downscaling of semiconductor devices, essential for high performance and energy efficiency of future microe... » read more

Verifying The Integrity Of ICs Based On Their Electromagnetic (EM) Near-Field Emissions


A technical paper titled “Contact-Less Integrity Verification of Microelectronics Using Near-Field EM Analysis” was published by researchers at University of Florida and Brookhaven National Laboratory. Abstract: "Modern microelectronics life-cycle and supply chain ecosystem bring multiple untrusted entities, which can compromise their integrity. A major integrity issue of microelectronics... » read more

Research Bits: October 3


Growing indium selenide at scale Researchers from the University of Pennsylvania, Brookhaven National Laboratory, and the Air Force Research Laboratory grew the 2D semiconductor indium selenide (InSe) on a full-size, industrial-scale wafer. It can also be deposited at temperatures low enough to integrate with a silicon chip. The team noted that producing large enough films of InSe has prove... » read more

Technical Paper Roundup: Sept 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=136 /] (more…) » read more

A New Layered Structure With 2D Material That Exhibits A Unique Transfer Of Energy And Charge


A technical paper titled “Excitation-Dependent High-Lying Excitonic Exchange via Interlayer Energy Transfer from Lower-to-Higher Bandgap 2D Material” was published by researchers at University of Warsaw, Brookhaven National Laboratory, and National Institute for Materials Science (Japan). Abstract: "High light absorption (∼15%) and strong photoluminescence (PL) emission in monolayer (1L... » read more

Technical Paper Roundup: Sept 5


New technical papers added to Semiconductor Engineering’s library this week. [table id=132 /] (more…) » read more

Week In Review: Auto, Security, Pervasive Computing


The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Distributed Batteries Within A Heterogeneous 3D IC To Optimize Performance


A technical paper titled “On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits” was published by researchers at University of Florida and Brookhaven National Laboratory. Abstract: "Energy efficiency in digital systems faces challenges due to the constraints imposed by small-scale transistors. Moreover, the growing demand for portable consumer electr... » read more

Directed Self-Assembly Finds Its Footing


Ten years ago, when the industry was struggling to deliver EUV lithography, directed self-assembly (DSA) roared to the forefront of research and development for virtually every manufacturer determined to extend the limits of 193i. It was the hot topic at of the 2012 SPIE Advanced Lithography Conference, with one attendee from Applied Materials comparing its potential to disrupt the industry to ... » read more

Chip Industry’s Technical Paper Roundup: July 12


New technical papers recently added to Semiconductor Engineering’s library: [table id=117 /] (more…) » read more

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