Glass Substrates Gain Foothold In Advanced Packages

Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today. There are still plenty of problems to solve before this approach becomes mainstream. While glass itself is cheap and shares some important physical similarities to silicon, there are challenges with buildup, stre... » read more

MEMS Device Cleaning

Cleaning is an essential process for MEMS applications in order to prevent device failure due to foreign material. Small particles located on MEMS devices are significant causes of device rejection and yield loss. These issues affect inertial devices, such as accelerometers and gyroscopes, as well as microphones, laser bars and other MEMS devices. Click here to download. » read more

Bump Reliability is Challenged By Latent Defects

Thermal stress is a well-known problem in advanced packaging, along with the challenges of mechanical stress. Both are exacerbated by heterogenous integration, which often requires mingling materials with incompatible coefficients of thermal expansion (CTE). Effects are already showing up and will likely only get worse as package densities increase beyond 1,000 bumps per chip. “You comb... » read more

Quantification Of Steels And Alloys Using A Dual Source Multidetector System On SEM

The accurate and precise analysis of steels and alloys is essential for understanding their mechanical and thermal properties. Such materials often have a wide range of elements at various concentrations down to trace ppm levels. Accordingly, it is not possible to determine the concentrations of all elements with a standard scanning electron microscope (SEM) and an energy dispersive spectromete... » read more

Making 5G More Reliable

The rollout of 5G is a complex and monumental effort involving multiple separate systems that need to function flawlessly together in real-time, making it difficult to determine where problems might arise, or how and when to test for them. Investments in 5G have been underway for the better part of a decade, and the technology is considered the next huge growth opportunity for mobile devices... » read more

Enabling Test Strategies For 2.5D, 3D Stacked ICs

Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

Deep Learning To Classify And Establish Structure Property Predictions With PeakForce QNM Atomic Force Microscopy

Machine learning and specifically, deep learning, is a powerful tool to establish the presence (or absence) of microstructure correlations to bulk properties with its ability to flesh out relationships and trends that are difficult to establish otherwise. This application note discusses the use of deep learning tools, to explore AFM phase and PeakForce Quantitative Nanomechanics (QNM) im... » read more

Nanosheet FETs Drive Changes In Metrology And Inspection

In the Moore’s Law world, it has become a truism that smaller nodes lead to larger problems. As fabs turn to nanosheet transistors, it is becoming increasingly challenging to detect line-edge roughness and other defects due to the depths and opacities of these and other multi-layered structures. As a result, metrology is taking even more of a hybrid approach, with some well-known tools moving... » read more

Advantages Of Measuring Surface Roughness With White Light Interferometry

The concept of measuring surface roughness originated nearly a century ago as a means to prevent uncertainty and disputes between manufacturers and buyers. Now, it has become a common identifier used throughout industry for validating manufacturing processes, confirming adherence to both internal and regulatory specifications, and guaranteeing quality and performance of end products. Subjective... » read more

E-beam’s Role Grows For Detecting IC Defects

The perpetual march toward smaller features, coupled with growing demand for better reliability over longer chip lifetimes, has elevated inspection from a relatively obscure but necessary technology into one of the most critical tools in fab and packaging houses. For years, inspection had been framed as a battle between e-beam and optical microscopy. Increasingly, though, other types of insp... » read more

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