tag: Cadence Design Systems

Week in Review: Iot, Security, Automotive
By Susan Rambo - 08 Nov, 2019 - Comments: 0

IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 25 Oct, 2019 - Comments: 0

Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

Does System Design Still Need Abstraction?
By Frank Schirrmeister - 24 Oct, 2019 - Comments: 0

About 15 years ago, the assumption in the EDA industry was that system design would be inevitable. The transition from gate-level design to a new entry point at the register transfer level (RTL) seemed complete with logic synthesis becoming well-adopted. The next step seemed to be so obvious at the time: High-level synthesis (HLS) and transaction-based development beyond RTL—also taking into ... » read more

Compressing Datasets Created During Silicon Design
By Cadence - 23 Oct, 2019 - Comments: 0

Authors: Guru Rao, Distinguished Engineer; Shakir Abbas, Software Engineering Group Director; Mohammad Mirfendereski, Configuration Management Architect; Cadence. Harsh Sharangpani, CEO and CTO; Rajesh Patil, VP-Business Development; Ascava. During the design cycle for modern semiconductor components, a very large amount of data is generated and stored, often accumulating to hundreds of tera... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch And Susan Rambo - 18 Oct, 2019 - Comments: 0

Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 11 Oct, 2019 - Comments: 0

Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 04 Oct, 2019 - Comments: 0

Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

Celsius Thermal Solver
By Cadence - 25 Sep, 2019 - Comments: 0

The Celsius Thermal Solver environment enables all aspects of thermal analysis to quickly and accurately identify thermal problems in IC packages, PCBs, and electronics systems. It features an innovative massive parallel solver technology that enables simulation speeds up to 10 times faster than conventional thermal simulators, with significantly reduced memory usage. It includes a powerful fin... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 20 Sep, 2019 - Comments: 0

Products/Services Synopsys had a lot of announcements this week! Summer is definitely over. The company released BSIMM10 study, the latest version of the Building Security in Maturity Model, helping organizations plan, execute, mature, and measure their software security initiatives. It also released LucidShape version 2019.09, the latest version of that tool for the design, simulation, and an... » read more

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