tag: Cadence Design Systems

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 06 Mar, 2020 - Comments: 0

Pervasive computing — health An injectable biosensor may someday help measure signs of influenza. DARPA (the U.S. Department of Defense’s Defense Advanced Research Projects Agency) and digital health startup Profusa announced a study that uses Profusa’s Lumee Oxygen Platform to find ways to identify flu outbreaks, biological attacks and pandemics as much as three weeks earlier than curre... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 28 Feb, 2020 - Comments: 0

AI/Edge The United States Department of Defense (DOD) has adopted ethical principles for using artificial intelligence in warfare that chiefly say the U.S. has to follow the laws, treaties, in use of AI in warfare. Any AI used by DOD has to be responsible, equitable, traceable, reliable and governable. “The Department will design and engineer AI capabilities to fulfill their intended functio... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 Feb, 2020 - Comments: 0

AI The European Union put out a white paper about artificial intelligence. The United States Chief Technology Officer Michael Kratsios criticized the EU stance on Thursday as clumsy. "We found, what they actually put out yesterday, really, I think, in some ways clumsily attempts to bucket AI-powered technologies as either ‘high-risk’ or ‘not high-risk,’” he said, according to a news ... » read more

Week In Review: IoT, Security, Autos
By SE Staff - 17 Jan, 2020 - Comments: 0

The United States signed trade agreements with the China (phase one agreement) and North American countries Mexico and Canada this week. The SIA (Semiconductor Industry Association), which represents the U.S. semiconductor industry, applauded the agreements. Still to be worked out is the second part, or phase two, of the U.S.’s agreement with China. AI/Edge M&A Apple is acquiring edge... » read more

Transient Thermal Analysis For M.2 SSD Thermal Throttling: Detailed CFD Model vs Network-Based Model
By Cadence - 15 Jan, 2020 - Comments: 0

Solid State Drive (SSD) technology continues to advance toward smaller footprints with higher bandwidth and adoption of new I/O interfaces in the PC market segment. Power performance requirements are tightening in the design process to address specific requirement along with the development of SSD technology. To meet this aggressive requirement of performance, one major issue is thermal throttl... » read more

Week In Review: IoT, Security, Autos
By SE Staff - 10 Jan, 2020 - Comments: 0

Internet of Things Sensors that see in the dark, look deep into our faces and hear the impossible, were all part of ams’ CES lineup this week. ams announced that it has designed an advanced spectral ambient light sensor (ALS) for high-end mobile phone cameras. The ALS, called the AS7350, identifies the light source and makes an accurate white balance under low-light and other non-ideal condi... » read more

Building A State-of-the-Art Verification Environment
By Cadence - 08 Jan, 2020 - Comments: 0

The key challenge: Build an environment with state-of-the-art verification technologies, as a model case for succeeding projects, with: • Maximum reuse of legacy IP cores and verification environments • Short turnaround time • High-quality results The customer: A global leader in microcontroller (MCU), analog, power, and system-on-chip (SoC) products, Renesas Electronics Corporation... » read more

Week in Review: IoT, Security and Automotive
By SE Staff - 13 Dec, 2019 - Comments: 0

Internet of Things Western Digital Corp. and Codasip are working together on Western Digital’s SweRV Core EH1, which is a RISC-V core with a 32-bit, dual superscalar, 9-stage pipeline architecture. The core, launched earlier this is aimed at embedded devices supporting data-intensive edge applications, such as storage controllers, industrial IoT, real-time analytics in surveillance systems, ... » read more

Interdependencies Complicate IC Power Grid Design
By Ann Mutschler - 12 Dec, 2019 - Comments: 0

Creating the right power grid is a growing problem in leading-edge chips. IP and SoC providers are spending a considerable amount of time defining the architecture of logic libraries in order to enable different power grids to satisfy the needs of different market segments. The end of Dennard scaling is one of the reasons for the increased focus. With the move to smaller nodes, the amount of... » read more

System Electrothermal Transient Analysis of A High Current (40A) Synchronous Step Down Converter
By Cadence - 11 Dec, 2019 - Comments: 0

Authors: Rajen Murugan, Jie Chen, and Todd Harrison of Texas Instruments, Inc. and C.T. Kao and Nathan Ai of Cadence Design Systems; from Proceedings of the ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, IPACK2019, October 7-9, 2019, Anaheim, CA, USA In this paper, we detailed the system electrothermal transi... » read more

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