Beyond Autonomous Cars

By Marie C. Baca - 12 Oct, 2022 - Comments: 0

As the automotive industry takes a more measured approach to self-driving cars and long-haul trucks for safety and security reasons, there is a renewed focus on other types of vehicles utilizing autonomous technology. The list is long and growing. It now includes autonomous trains, helicopters, tractors, ships, submarines, drones, delivery robots, motorcycles, scooters, and bikes, all of whi... » read more

Blog Review: Oct. 12

By Jesse Allen - 12 Oct, 2022 - Comments: 0

Synopsys' Richard Solomon, Madhumita Sanyal, and Gary Ruggles take a look at the possibilities that CXL 3.0 can bring to a variety of data-driven applications that demand increasingly higher levels of memory capacity, with higher bandwidth, more security, and lower latency. Siemens EDA's Rich Edelman provides some tips for debugging UVM testbenches, such as how to determine what line changed... » read more

Week in Review: Design, Low Power

By Marie C. Baca - 07 Oct, 2022 - Comments: 0

Could power beams be the key to smart city infrastructure and 5G/6G connectivity? A new report says both lasers and microwaves offer possible paths forward in this area, though both technologies come with benefits and drawbacks. Diminishing returns from process scaling, coupled with pervasive connectedness and an exponential increase in data, are driving broad changes in how chips are desi... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 07 Oct, 2022 - Comments: 0

Automotive, mobility Infineon opened a new factory in Cegléd, Hungary, for assembly and test of high-power semiconductor modules for EVs. “The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications,” said Infineon’s COO Rutger Wijburg in a press release. Production ramp-up started in February 2022. Infineon also announced it will ... » read more

EVs Raise Energy, Power, And Thermal IC Design Challenges

By Ann Mutschler - 06 Oct, 2022 - Comments: 0

The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

Formula 1: Riding The Sustainability Wave To Full Electrification

By Steve Brown - 06 Oct, 2022 - Comments: 0

Ferdinand Porsche once said, "The perfect race car crosses the finish line 1st and then crumbles into its individual parts." What a take, right? Well, in the 90s, that's the best they could hope for. Let's go back to the 1990s of Formula 1 (F1). The time was marked by extreme competition among racing teams. There was more freedom in the engine you could run, meaning that teams could choose b... » read more

Auto Safety Tech Adds New IC Design Challenges

By John Koon - 06 Oct, 2022 - Comments: 1

The role of AI/ML in automobiles is widening as chipmakers incorporate more intelligence into chips used in vehicles, setting the stage for much safer vehicles, fewer accidents, but much more complex electronic systems. While full autonomy is still on the distant horizon, the short-term focus involves making sure drivers are aware of what's going on around them — pedestrians, objects, or o... » read more

Ensuring Data Integrity And Performance Of High-Speed Data Transmission

By Cadence - 05 Oct, 2022 - Comments: 0

In key electronics applications such as data centers, automotive, and 5G, the data speed and volume are increasing at an exponential rate. Data centers require data transmission (Figure 1) as high as 112Gbps, which can be achieved only using PAM4 signaling. The automotive industry is dealing with the challenges of transferring data between various electronic control units (ECUs) at a very high ... » read more

Blog Review: Oct. 5

By Jesse Allen - 05 Oct, 2022 - Comments: 0

Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

IC Architectures Shift As OEMs Narrow Their Focus

By Ed Sperling - 03 Oct, 2022 - Comments: 0

Diminishing returns from process scaling, coupled with pervasive connectedness and an exponential increase in data, are driving broad changes in how chips are designed, what they're expected to do, and how quickly they're supposed to do it. In the past, tradeoffs between performance, power, and cost were defined mostly by large OEMs within the confines of an industry-wide scaling roadmap. Ch... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?