tag: Cadence

Power Domain Implementation Challenges Escalate
By Ann Mutschler - 20 Jun, 2022 - Comments: 0

The number power domains is rising as chip architects build finer-grained control into chips and systems, adding significantly to the complexity of the overall design effort. Different power domains are an essential ingredient in partitioning of different functions. This approach allows different chips in a package, and different blocks in an SoC, to continue running with just enough power t... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Jun, 2022 - Comments: 0

Tools, design, chips Altair, a provider of software and cloud services for CAE, HPC, simulation, and data analysis, acquired Concept Engineering, a provider of automatic schematic generation tools, electronic circuit and wire harness visualization platforms that provide on-the-fly visual rendering, and electronic design debug solutions. “Concept Engineering’s advanced, reactive visualizati... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Jun, 2022 - Comments: 0

Automotive, mobility U.S. National Highway Traffic Safety Administration (NHTSA) release its first crash reports from ADAS (advanced driver assistance systems, i.e., SAE Level 2) and ADS (automated driving systems, i.e., SAE Levels 3-5).  The systems had to be in use at least 30 seconds before the crash in order for it to be reportable. The car may have had the system turned off at the time ... » read more

Blog Review: June 15
By Jesse Allen - 15 Jun, 2022 - Comments: 0

Ansys' Vidyu Challa considers common primary, or single-use, battery chemistries and how they affect that many important cell properties, such as energy density, flammability and safety, available cell constructions, temperature range, and shelf life. Synopsys' Rimpy Chugh and Rohit Kumar Ohlayan discuss some of the challenges arising from static linting of code, shifting linting left in the... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs
By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Jun, 2022 - Comments: 0

Edge, embedded, IoT Renesas Electronics will acquire Reality Analytics, Inc. (Reality AI), a provider of embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial, and commercial products. The inference-based AI solutions can be implemented across various endpoint AI applications. “Customers are increasingly demanding highly customized solutions involving emb... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Jun, 2022 - Comments: 0

Automotive, mobility Lightyear, an automotive company based in the Netherlands, announced its solar car, the Lightyear 0, which goes into production this year. The car has a Worldwide Harmonised Light Vehicle Test Procedure (WLTP) range of 625 kilometers/388 miles and can charge itself while driving or parked, using double curved solar arrays on its roof. The daily charging adds 70 kilometers/... » read more

DRAM Thermal Issues Reach Crisis Point
By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

Khronos: Open Standards Powering The Future Of Embedded Vision
By Paul McLellan - 09 Jun, 2022 - Comments: 0

At the recent Embedded Vision Summit, one of the presentations was by Neil Trevett of The Khronos Group. This is a standardization body and is a non-profit. He said that his day job is at Nvidia. It has been creating standards for 20 years with a focus on low-level hardware acceleration APIs for 3D graphics, parallel computation, augmented reality (AR), virtual reality (VR), and machine learnin... » read more

Removing Barriers For End-To-End Analytics
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end analytics. While the promise of big data analytics is well understood, data sharing through the semiconductor supply chain has been stymied by an inability to link together data sources throughout the lifecycle of a chip, package, or ... » read more

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