tag: Cadence

Preparing For 3D-ICs
By Ed Sperling - 16 Feb, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

Blog Review: Feb. 16
By Jesse Allen - 16 Feb, 2022 - Comments: 0

Arm's Mark Nicholson explains the software side of the Morello project to implement a prototype security-focused architecture, presenting a high-level view of the software stacks and discussing the status and roadmap of a range of activities. Synopsys' Ron Lowman finds that as IoT technology and capabilities of portable devices expand, the deployment of 5G networks and interest in AI and aut... » read more

Improving PPA In Complex Designs With AI
By John Koon - 14 Feb, 2022 - Comments: 0

The goal of chip design always has been to optimize power, performance, and area (PPA), but results can vary greatly even with the best tools and highly experienced engineering teams. Optimizing PPA involves a growing number of tradeoffs that can vary by application, by availability of IP and other components, as well as the familiarity of engineers with different tools and methodologies. Fo... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Feb, 2022 - Comments: 0

Nvidia's proposed acquisition of Arm is officially off. The deal faced significant pushback from regulatory agencies in the UK, USA, and Europe, which feared it would reduce or limit competition in areas like data center. Nvidia indicated it would continue working with Arm, and it will retain a 20-year Arm license. (SoftBank will retain the $1.25 billion prepaid by Nvidia.) SoftBank said it wil... » read more

CFD Playing Increasing Role In Design
By Ann Mutschler - 10 Feb, 2022 - Comments: 0

With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Why Data Center Power Will Never Come Down
By Bryon Moyer - 10 Feb, 2022 - Comments: 3

Data centers have become significant consumers of energy. In order to deal with the proliferation of data centers and the servers within them, there is a big push to reduce the energy consumption of all data center components. With all that effort, will data center power really come down? The answer is no, despite huge improvements in energy efficiency. “Keeping data center power consum... » read more

Spreadsheets: Still Valuable, But More Limited
By Brian Bailey - 10 Feb, 2022 - Comments: 1

Spreadsheets have been an invaluable engineering tool for many aspects of semiconductor design and verification, but their inability to handle complexity is squeezing them out of an increasing number of applications. This is raising questions about whether they still have a role, and if so, how large that role will be. There are two sides to this issue. On one side are the users who see them... » read more

Design Challenges Increasing For Mixed-Die Packages
By Ann Mutschler - 09 Feb, 2022 - Comments: 0

The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design
By Cadence - 09 Feb, 2022 - Comments: 0

In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

Blog Review: Feb. 9
By Jesse Allen - 09 Feb, 2022 - Comments: 0

Arm's Mark Inskip walks through how the Morello program built a demonstration of the architecture that enables fine-grained memory protection and highly scalable software compartmentalization based on the CHERI (Capability Hardware Enhanced RISC Instructions) architectural model, from IP development and SoC design to creating software and a demonstration board. Synopsys' Plamen Asenov and su... » read more

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