Research Bits: November 21


MoS2 in-memory processor Researchers from École Polytechnique Fédérale de Lausanne (EPFL) developed a large-scale in-memory processor using the 2D semiconductor material, molybdenum disulfide (MoS2), for the channel material in the more than 1,000 transistors that comprise the processor. The MoS2-based in-memory processor is dedicated to vector-matrix multiplication, key for digital signal ... » read more

Chip Industry’s Technical Paper Roundup: June 20


New technical papers added to Semiconductor Engineering’s library this week. [table id=112 /] » read more

End-To-End System Architecture For Quantum RAM (Yale, AWS, Caltech)


A technical paper titled “Systems Architecture for Quantum Random Access Memory” was published by researchers at Yale University, AWS Center for Quantum Computing, and California Institute of Technology. Abstract: "Operating on the principles of quantum mechanics, quantum algorithms hold the promise for solving problems that are beyond the reach of the best-available classical algorithms.... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Lithography Modeling: Data Augmentation Framework


A new technical paper titled "An Adversarial Active Sampling-based Data Augmentation Framework for Manufacturable Chip Design" was published by researchers at the University of Texas at Austin, Nvidia, and the California Institute of Technology. Abstract: "Lithography modeling is a crucial problem in chip design to ensure a chip design mask is manufacturable. It requires rigorous simulation... » read more

Progress On General-Purpose Quantum Computers


The race is on to scale up quantum computing, transforming it from an esoteric research tool into a commercially viable, general-purpose machine. Special-purpose quantum computers have been available for several years now. Systems like D-Wave’s Advantage focus on specific classes of problems that are amenable to modeling as quantum systems. Still, the ultimate goal of having a general purp... » read more

Manufacturing Bits: Sept. 8


Calibrating a microphone The National Institute of Standards and Technology (NIST) has developed a faster and more accurate way to calibrate a microphone. NIST’s new calibration technique makes use of lasers, a promising technology that could supplant today’s methods. The technology could one day be used to calibrate sensitive microphones in factories, power plants and other settings li... » read more

Power/Performance Bits: Sept. 9


Smaller, cheaper integrated photonics Researchers from the University of California Santa Barbara, California Institute of Technology (Caltech), and Ecole Polytechnique Fédérale de Lausanne (EPFL) developed a way to integrate an optical frequency comb on a silicon photonic chip. Optical frequency combs are collections of equally spaced frequencies of laser light (so called because when pl... » read more

Power/Performance Bits: June 23


Capturing waste heat Researchers at Wuhan University and University of California Los Angeles developed a hydrogel that can both cool down electronics and convert the waste heat into electricity. The thermogalvanic hydrogel consists of a polyacrylamide framework infused with water and specific ions. When they heated the hydrogel, two of the ions (ferricyanide and ferrocyanide) transferred e... » read more

Manufacturing Bits: June 8


Maskless EUV lithography At this week’s 2020 EUVL Workshop, KJ Innovation will present more details about its efforts to develop a maskless extreme ultraviolet (EUV) lithography technology. Still in R&D, KJ Innovation’s maskless EUV technology involves a high-numerical aperture (high-NA) system with 2 million individual write beams. The 0.55 NA technology is targeted for direct-write l... » read more

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