SOT-MRAM To Challenge SRAM

By Bryon Moyer - 13 Jan, 2022 - Comments: 1

In an era of new non-volatile memory (NVM) technologies, yet another variation is poised to join the competition — a new version of MRAM called spin-orbit torque, or SOT-MRAM. What makes this one particularly interesting is the possibility that someday it could supplant SRAM arrays in systems-on-chip (SoCs) and other integrated circuits. The key advantages of SOT-MRAM technology are the pr... » read more

Week In Review: Design, Low Power

By Jesse Allen - 17 Dec, 2021 - Comments: 0

Memory CEA-Leti demonstrated 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node. It utilizes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm² and solder reflow compatibility for the first time for this type of memory. The researchers anticipate it will be useful for embedded applications such at IoT and wearable dev... » read more

Manufacturing Bits: Nov. 24

By Mark LaPedus - 24 Nov, 2021 - Comments: 0

Tiny MEMS gyroscope CEA-Leti and Politecnico di Milano (POLIMI) have developed the world’s smallest MEMS gyroscope. Based on a nano-resistive sensing technology, the gyroscope enables a navigation-grade performance with a sensor footprint of only 1.3mm2. The tiny gyroscope is targeted for high-volume markets like automotive and others. The technology was reported in a paper, entitled “1... » read more

Week In Review: Manufacturing, Test

By Linda Christensen - 24 Sep, 2021 - Comments: 1

Markets Worldwide semiconductor industry revenue is expected to grow 17.3% in 2021, compared with 10.8% in 2020, according to a new IDC report. Segment breakdown is as follows: [table id=5 /] “Semiconductor wafer prices increased in 1H21 and IDC expects increases to continue for the rest of 2021 due to material costs and opportunity cost in mature process technologies. Overall, IDC pre... » read more

Angstrom-Level Measurements With AFMs

By Mark LaPedus - 19 Aug, 2021 - Comments: 0

Competition is heating up in the atomic force microscopy (AFM) market, where several vendors are shipping new AFM systems that address various metrology challenges in packaging, semiconductors and other fields. AFM, a small but growing field that has been under the radar, involves a standalone system that provides surface measurements on structures down to the angstrom level. (1 angstrom = 0... » read more

Manufacturing Bits: July 13

By Mark LaPedus - 13 Jul, 2021 - Comments: 0

Heterogenous III-V packaging At the recent 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), a group presented a paper on the development of a wafer-level fan-out package using heterogenous III-V devices. This paper deals with the packaging of two III-V chips for use in RF transceiver applications in base stations. III-V Lab, CEA-Leti, Thales and United Monolithic Semic... » read more

Week In Review: Design, Low Power

By Jesse Allen - 18 Jun, 2021 - Comments: 0

Rambus is making a push for Compute Express Link (CXL) with two acquisitions and the launch of its CXL Memory Interconnect Initiative. The initiative aims to define and develop semiconductor solutions for advanced data center architectures, with initial research and development focusing on solutions to support key memory expansion and pooling use cases. CXL is an open interconnect specificat... » read more

Manufacturing Bits: April 27

By Mark LaPedus - 27 Apr, 2021 - Comments: 0

Next-gen neuromorphic computing The European Union (EU) has launched a new project to develop next-generation devices for neuromorphic computing systems. The project, called MeM-Scales, plans to develop a novel class of algorithms, devices, and circuits that reproduce multi-timescale processing of biological neural systems. The results will be used to build neuromorphic computing systems th... » read more

Manufacturing Bits: Feb. 16

By Mark LaPedus - 16 Feb, 2021 - Comments: 0

Hybrid bonding consortium for packaging A*STAR’s Institute of Microelectronics (IME) and several companies have formed a new consortium to propel the development of hybrid bonding technology for chip-packaging applications. The group, called the Chip-to-Wafer (C2W) Hybrid Bonding Consortium, includes A*STAR’s IME organization, Applied Materials, ASM Pacific, Capcon, HD MicroSystems, ONT... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 12 Feb, 2021 - Comments: 0

Chipmakers The U.S. Semiconductor Industry Association (SIA) and several chip executives have sent a joint letter to President Biden, urging the administration to include substantial funding for semiconductor manufacturing and research in the U.S. As reported, the share of global semiconductor manufacturing capacity in the U.S. has decreased from 37% in 1990 to 12% today. “Semiconductors pow... » read more

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tag: CEA-Leti

SOT-MRAM To Challenge SRAM

Week In Review: Design, Low Power

Manufacturing Bits: Nov. 24

Week In Review: Manufacturing, Test

Angstrom-Level Measurements With AFMs

Manufacturing Bits: July 13

Week In Review: Design, Low Power

Manufacturing Bits: April 27

Manufacturing Bits: Feb. 16

Week In Review: Manufacturing, Test

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