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Week In Review: Auto, Security, Pervasive Computing


The U.S. Department of Defense updated the directive that governs the development and fielding of autonomous and semi-autonomous weapon systems. The revisions include an expanded focus on artificial intelligence, and reference to recently-established organizations like the DoD’s Chief Digital and Artificial Intelligence Office. NIST released a new guidance document aimed at helping organi... » read more

Chip Industry’s Technical Paper Roundup: Oct 25


New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

On-chip 2D/3D Photonics Integration Solution Using Deposited Polycrystalline Silicon for Optical Interconnects Applications


A new technical paper titled "Polycrystalline silicon PhC cavities for CMOS on-chip integration" was published by researchers at Tyndall National Institute, Munster Technological University, and Université Grenoble Alpes, CEA, LETI. "In this work, we present an on-chip 2D and 3D photonics integration solution compatible with Front End of Line integration (FEOL) using deposited polycrystalli... » read more

Chip Industry’s Technical Paper Roundup: Oct. 4


New technical papers added to Semiconductor Engineering’s library this week. [table id=55 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Adaptive Memristive Hardware


A new technical paper titled "Self-organization of an inhomogeneous memristive hardware for sequence learning" was just published by researchers at University of Zurich, ETH Zurich, Université Grenoble Alpes, CEA, Leti and Toshiba. "We design and experimentally demonstrate an adaptive hardware architecture Memristive Self-organizing Spiking Recurrent Neural Network (MEMSORN). MEMSORN incorp... » read more

Spin–Orbit Qubit With A Single Hole Electrostatically Confined In A Natural Silicon Metal-Oxide-Semiconductor Device


A new technical paper titled "A single hole spin with enhanced coherence in natural silicon" was published by researchers at Université Grenoble Alpes, CEA, LETI, and CNRS. Abstract: "Semiconductor spin qubits based on spin–orbit states are responsive to electric field excitations, allowing for practical, fast and potentially scalable qubit control. Spin electric susceptibility, however,... » read more

Technical Paper Round-Up: June 21


New technical papers added to Semiconductor Engineering’s library this week. [table id=34 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

End-to-End System for Object Localization By Coupling pMUTs to a Neuromorphic RRAM-based Computational Map


New research paper titled "Neuromorphic object localization using resistive memories and ultrasonic transducers" from researchers at CEA, LETI, Université Grenoble Alpes and others. Abstract "Real-world sensory-processing applications require compact, low-latency, and low-power computing systems. Enabled by their in-memory event-driven computing abilities, hybrid memristive-Complementary... » read more

Factoring 2048-bit RSA Integers in 177 Days with 13 436 Qubits and a Multimode Memory


Abstract: "We analyze the performance of a quantum computer architecture combining a small processor and a storage unit. By focusing on integer factorization, we show a reduction by several orders of magnitude of the number of processing qubits compared with a standard architecture using a planar grid of qubits with nearest-neighbor connectivity. This is achieved by taking advantage of a tem... » read more

Manufacturing Bits: Dec. 29


Chiplet-based exascale computers At the recent IEEE International Electron Devices Meeting (IEDM), CEA-Leti presented a paper on a 3D chiplet technology that enables exascale-level computing systems. The United States and other nations are working on exascale supercomputers. Today’s supercomputers are measured in floating point operations per second. The world’s fastest supercomputers c... » read more

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