Chip Industry Technical Paper Roundup: Sept. 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=358 /] More ReadingTechnical Paper Library home » read more

Better Security and Power Efficiency of Ascon HW Implementation with STT-MRAM (CEA, et al.)


A new technical paper titled "Enhancing Security and Power Efficiency of Ascon Hardware Implementation with STT-MRAM" was published by researchers at CEA, Leti, Université Grenoble Alpes, CNRS, and Spintec. Abstract "With the outstanding growth of Internet of Things (IoT) devices, security and power efficiency of integrated circuits can no longer be overlooked. Current approved standards f... » read more

Chip Industry Technical Paper Roundup: March 26


New technical papers recently added to Semiconductor Engineering’s library. [table id=209 /] Find last week's technical paper additions here. » read more

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design


A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

Chip Industry Technical Paper Roundup: Jan 2


New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

Memory Devices-Based Bayesian Neural Networks For Edge AI


A new technical paper titled "Bringing uncertainty quantification to the extreme-edge with memristor-based Bayesian neural networks" was published by researchers at Université Grenoble Alpes, CEA, LETI, and CNRS. Abstract: "Safety-critical sensory applications, like medical diagnosis, demand accurate decisions from limited, noisy data. Bayesian neural networks excel at such tasks, offering... » read more

Week In Review: Auto, Security, Pervasive Computing


The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Security Research: Technical Paper Round-up


A number of hardware security-related technical papers were presented at the August 2023 USENIX Security Symposium. Here are some highlights with associated links. [table id=130 /] A complete listing of all papers presented at this summer's USENIX conference can be found here and here. The organization provides open access research, and the presentation slides and papers are free to the p... » read more

Formal Processor Model Providing Provably Secure Speculation For The Constant-Time Policy


A new technical paper titled "ProSpeCT: Provably Secure Speculation for the Constant-Time Policy" was published by researchers at imec-DistriNet, KU Leuven, CEA, and INRIA. This paper was included at the recent 32nd USENIX Security Symposium. Abstract: "We propose ProSpeCT, a generic formal processor model providing provably secure speculation for the constant-time policy. For constant-tim... » read more

Week In Review: Semiconductor Manufacturing, Test


Restrictions on China continue to grow. The Biden Administration is considering more restrictions on selling advanced AI chips to China, according to multiple media reports. Meanwhile, the Dutch government is expected to limit the sale of manufacturing equipment. JIC Capital, the wholly owned subsidiary of Japan Investment Corporation (JIC), will purchase materials company JSR Corp. through ... » read more

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