Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 04 Feb, 2022 - Comments: 0

Pervasive computing, IoT and 5G The U.S. company SpaceX deployed more satellites into LEO (low earth orbit) Starlink constellation and launched a premium service for businesses that costs $500 a month, bringing download speeds of 150-500 Mbps and latency of 20-40ms. The regular Starlink service is $99 a month. Starlink has launched over 2,000 satellites into its constellation, according to sta... » read more

Week In Review: Design, Low Power

By Jesse Allen - 28 Jan, 2022 - Comments: 0

Kalray, a provider of programmable data processing and storage acceleration cards for data centers, will acquire Arcapix Holdings, which provides software-defined storage and data management solutions for data-intensive applications. "I am delighted at the prospect of this acquisition that will accelerate our go-to-market and strengthen our key position in the data-intensive storage market. It ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 07 Jan, 2022 - Comments: 0

SK Hynix completed the first phase of its acquisition of Intel's NAND and SSD business. In this first step it took control Intel’s SSD business and the Dalian NAND flash manufacturing facility in China, for a price of $7 billion. Next, it will acquire from Intel the remaining assets in relation to its NAND business, including IP related to the manufacture and design of NAND flash wafers, R&am... » read more

Week In Review: Design, Low Power

By Jesse Allen - 23 Jul, 2021 - Comments: 0

Tools Cadence unveiled Cerebrus Intelligent Chip Explorer, a new machine learning-based tool to drive the Cadence RTL-to-signoff implementation flow. The tool aims to use reinforcement learning to find flow solutions that otherwise might not be explored and applies models to future designs. The company says it can improve productivity up to 10X and PPA up to 20% with optimization of the flow f... » read more

Week In Review: Design, Low Power

By Jesse Allen - 25 Jun, 2021 - Comments: 0

Synopsys will acquire the semiconductor and flat panel display solutions of BISTel. The acquisition will add an integrated and comprehensive yield management and prediction solution for manufacturing quality and efficiency. BISTel provides engineering equipment systems and AI applications for smart manufacturing in a range of industries. "Combining Synopsys' and BISTel's expertise in fab soluti... » read more

Week In Review: Design, Low Power

By Jesse Allen - 14 May, 2021 - Comments: 0

Siemens Digital Industries Software acquired Fractal Technologies, a provider of tools for IP validation and comparison checks of standard cell libraries, IO, and hard IP that reports mismatches or modeling errors, as well as comparing new IP releases close to tape-out. Siemens plans to add Fractal’s technology to the Xcelerator portfolio, joining the Solido software product family, which inc... » read more

Week In Review: Design, Low Power

By Jesse Allen - 26 Feb, 2021 - Comments: 0

Cadence completed the acquisition of NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. Founded in 1993 as a spin-off of the Vrije Universiteit Brussel (VUB), NUMECA was based in Brussels, Belgium. Terms of the deal were not disclosed... » read more

Week In Review: Design, Low Power

By Jesse Allen - 15 Jan, 2021 - Comments: 0

Qualcomm will acquire data center chip startup Nuvia for approximately $1.4 billion. Nuvia is working on a data center SoC and Arm-based CPU core it claims will lower performance per total cost of ownership by matching high performance with high efficiency and limiting maximum power to that which can be dissipated in an air-cooled environment. Qualcomm said Nuvia's technology would be incorpora... » read more

RISC-V’s Expanding Footprint

By Ed Sperling - 27 Aug, 2020 - Comments: 0

Zdenek Prikryl, CTO of Codasip, sat down with Semiconductor Engineering to talk about the RISC-V market, where this open instruction set architecture (ISA) is gaining ground, and what are the biggest challenges in working with this technology. SE: Where do you see the value in RISC-V? Is it for off-the-shelf processors or more customized components? Prikryl: A few years ago, RISC-V was us... » read more

Week In Review: Design, Low Power

By Jesse Allen - 10 Apr, 2020 - Comments: 0

MaxLinear will acquire Intel's Home Gateway Platform Division. MaxLinear, a provider of RF, analog, and mixed-signal ICs, will buy the Home Gateway Platform Division for an all-cash, asset transaction valued at $150 million. The division comprises Wi-Fi Access Points, Ethernet and Home Gateway SoC products deployed across operator and retail markets. The deal is expected to close in the third q... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: CEVA

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

RISC-V’s Expanding Footprint

Week In Review: Design, Low Power