tag: CFD

The Era Of Fluid Simulations In Hollywood
By Veena Parthan - 14 Apr, 2022 - Comments: 0

With the magnificent real images of water pouring from the sky and the after-fire fumes from a car, there is no escaping from the laws of physics in movies either! Fluid simulation in the '50s and '60s was modeled mathematically before the computer graphics industry made its appearance. In the early ’90s, computer graphics (CG) in movies such as Waterworld and Titanic were restricted to wi... » read more

Replicating da Vinci’s Aerial Vehicle Design
By Veena Parthan - 07 Apr, 2022 - Comments: 0

Unmanned aerial vehicles (UAVs), the prodigy of remotely piloted vehicles, largely used for military purposes, are slowly gaining momentum in our civil lives. Some of the applications of UAVs go beyond surveillance or photography: we already have drones that are employed by farmers to monitor crops and are used in the solar industry for thermographic studies. By 2026, UAVs for both consumer and... » read more

Planning EDA’s Next Steps
By Ed Sperling - 24 Mar, 2022 - Comments: 0

Anirudh Devgan, Cadence's new CEO, and the recipient of the Phil Kaufman Award in December, sat down with Semiconductor Engineering to talk about what's next in EDA, the underlying technology and business challenges and changes, and new markets that are unfolding for floor-planning, verification, CFD, and advanced packaging. SE: Where does EDA need to improve? Devgan: We have made it much... » read more

Preparing For 3D-ICs
By Ed Sperling - 16 Feb, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

CFD Playing Increasing Role In Design
By Ann Mutschler - 10 Feb, 2022 - Comments: 0

With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Improving Energy And Power Efficiency In The Data Center
By Ann Mutschler - 06 Dec, 2021 - Comments: 0

Energy costs in data centers are soaring as the amount of data being generated explodes, and it's being made worse by an imbalance between increasingly dense processing elements that are producing more heat and uneven server utilization, which requires more machines to be powered up and cooled. The challenge is to maximize utilization without sacrificing performance, and in the past that has... » read more

Progress And Challenges On The CFD Vision 2030 Roadmap
By John Chawner - 05 Aug, 2021 - Comments: 0

After a long writing (and longer editing and approval seeking) process, the AIAA's CFD Vision 2030 Integration Committee has published its first update to the Vision's roadmap. This 71 page, thoroughly cited report assesses progress toward the Vision during 2020 and also provides a 5-year look-back. It covers the six domains along which the vision assesses progress in CFD: high performance comp... » read more

Fluid Dynamics Of Sonic Booms From Supersonic Aircraft
By Anne-Marie Schelkens - 03 Jun, 2021 - Comments: 0

The return to supersonic flight is amongst the hottest topics in aviation today, as several companies (Boom Supersonic and Aerion, among others) are actively developing new supersonic commercial airliners targeted to enter in service in the coming years. In this context, a quiet flight over land is one of the major challenges to ensure the regulatory compliance of such airliners. Several resea... » read more

Mapping Heat Across A System
By Ann Mutschler - 13 May, 2021 - Comments: 0

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Achieving Physical Reliability Of Electronics With Digital Design
By John Parry - 14 Jan, 2021 - Comments: 0

By John Parry and G.A. (Wendy) Luiten With today’s powerful computational resources, digital design is increasingly used earlier in the design cycle to predict zero-hour nominal performance and to assess reliability. The methodology presented in this article uses a combination of simulation and testing to assess design performance, providing more reliability and increased productivity. ... » read more

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