Preparing For 3D-ICs


Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

CFD Playing Increasing Role In Design


With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Improving Energy And Power Efficiency In The Data Center


Energy costs in data centers are soaring as the amount of data being generated explodes, and it's being made worse by an imbalance between increasingly dense processing elements that are producing more heat and uneven server utilization, which requires more machines to be powered up and cooled. The challenge is to maximize utilization without sacrificing performance, and in the past that has... » read more

Progress And Challenges On The CFD Vision 2030 Roadmap


After a long writing (and longer editing and approval seeking) process, the AIAA's CFD Vision 2030 Integration Committee has published its first update to the Vision's roadmap. This 71 page, thoroughly cited report assesses progress toward the Vision during 2020 and also provides a 5-year look-back. It covers the six domains along which the vision assesses progress in CFD: high performance comp... » read more

Fluid Dynamics Of Sonic Booms From Supersonic Aircraft


The return to supersonic flight is amongst the hottest topics in aviation today, as several companies (Boom Supersonic and Aerion, among others) are actively developing new supersonic commercial airliners targeted to enter in service in the coming years. In this context, a quiet flight over land is one of the major challenges to ensure the regulatory compliance of such airliners. Several resea... » read more

Mapping Heat Across A System


Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Achieving Physical Reliability Of Electronics With Digital Design


By John Parry and G.A. (Wendy) Luiten With today’s powerful computational resources, digital design is increasingly used earlier in the design cycle to predict zero-hour nominal performance and to assess reliability. The methodology presented in this article uses a combination of simulation and testing to assess design performance, providing more reliability and increased productivity. ... » read more

Simulating The Hyperloop


When SpaceX held the first Hyperloop Design Weekend Competition in Texas in January 2016, a team of five students from the Universitat Politècnica de València (UPV) in Spain, calling themselves Hyperloop UPV, won awards for Best Overall Concept Design and Best Propulsion System. The overall concept was to use magnetic levitation to give their Hyperloop vehicle a frictionless ride through t... » read more

Speeding Up Electrical Vehicle Development With Designer-Centric Thermal And Electromagnetic Simulation And Analysis


By 2040, 54% of new car sales and 33% of the global car fleet is predicted to be electric [1]. More than six countries have announced a ban on internal-combustion engines. China is expected to be the largest market for electrical vehicles (EVs), which is driving automakers to make aggressive rollout plans for EVs. Some of the important trends driving EV development are getting more than 200 ... » read more

Heatsinks Here, There, Everywhere!


Heatsinks are often perceived to be the magic answer to all electronics cooling challenges. A heatsink makes heat spread out, so that it passes to the air over a much larger surface area than it would otherwise. Air then carries the heat away, cooling the electronics that generated it. So, why not place a heatsink on top of any thermally critical component? To read more, click here. » read more

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