Big Design, IP and End Market Shifts In 2020

By Brian Bailey - 30 Jan, 2020 - Comments: 0

EDA is on a roll. Design starts are up significantly thanks to increased investment in areas such as AI, a plethora of new communications standards, buildout of the Cloud, the race toward autonomous driving and continued advancements in mobile phones. Many designs demand the latest technologies and push the limits of complexity. Low power is becoming more than just reducing wasted power at t... » read more

Tech Talk: Applying Machine Learning

By Ed Sperling - 08 Feb, 2018 - Comments: 0

Norman Chang, chief technologist at ANSYS, talks about real applications of machine learning for mechanical, fluid dynamics and chip-package-system design. https://youtu.be/MqYX0wbwSfE » read more

Addressing Thermal Reliability In Next-Gen FinFET Designs

By Anusha Prakash - 18 Sep, 2017 - Comments: 0

The next generation of chips on the 10/7nm finFET processes will be able to cram more devices into same area while also boosting performance, but there's a price to pay for that. The 3D fin structures trap heat, so the the temperature rises on the device and there is no way to dissipate that heat. This combination of higher current density, higher performance and higher temperature has a det... » read more

How To Make Autonomous Vehicles Reliable

By Ann Mutschler - 11 Sep, 2017 - Comments: 1

The number of unknowns in automotive chips, subsystems and entire vehicles is growing as higher levels of driver assistance are deployed, sparking new concerns and approaches about how to improve reliability of these systems. Advanced Driver Assistance Systems (ADAS) will need to detect objects, animals and people, and they will be used for parking assistance, night vision and collision avoi... » read more

Why Do You Need Chip-Package-System Co-Design And Co-Analysis?

By Youngsoo Lee - 13 Oct, 2016 - Comments: 0

Whether it is the need for sustainable energy, or driving performance while keeping power at bay, or enabling safe and reliable operation of any electronic system, containment of electronic noise — power and signal noise is critical to all of the above. Other factors that impact safe and reliable operation are electromigration (EM), electromagnetic interference (EMI) and mechanical stress ena... » read more

Tackling RF Desense Challenges At The Source

By Margaret Schmitt - 14 Aug, 2015 - Comments: 0

Just imagine you are stepping out of the electronics store with your brand new smart phone. You eagerly scroll down your contacts to dial your best friend and proudly tell them the great news, but as soon as they pick up, your reception is gone! What happened? This problem is commonly described as desense, a degradation of the sensitivity of the receiver due to external noise sources. Desens... » read more

Technologies For Power, Signal, Thermal, And EMI Sign-Off

By Various Writers - 09 May, 2013 - Comments: 0

This paper discusses the challenges associated with designing smaller, faster, and lower cost products. It provides an overview of Apache's power and noise solutions and how these products enable comprehensive chip-package-system convergence flow across multiple design disciplines. To download this white paper, click here. » read more

Optimizing Cost-Performance-Schedule With A Chip-Package-System (CPS) Methodology

By Various Writers - 11 Apr, 2013 - Comments: 0

To meet smart device requirements with high levels of sophistication from an exceedingly small device running off a battery, the underlying electronics must evolve at a rapid pace. To read more, click here. » read more

Shock Value

By Norman Chang - 14 Mar, 2013 - Comments: 0

By Norman Chang Chip-Package-System (CPS) ESD simulation enables system-wide ESD robustness validation, a common challenge in automotive and aerospace applications. To enable CPS ESD analysis requires an accurate chip electrostatic discharge (ESD) model and a comprehensive system-level ESD methodology. Using an accurate ESD chip model provides the following three benefits. First it helps de... » read more

ANSYS And Apache Technologies For An Integrated Chip-Package-System Flow

By Various Writers - 17 Jan, 2013 - Comments: 0

This paper presents solutions for effectively managing design specifications (performance) and margins (price). It discusses solutions based on accurate and predictive simulation software from ANSYS and Apache that offers electronics designers a simulation-driven chip–package–system convergence methodology. To download this white paper, click here. » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: chip-package-system