tag: chiplets

Integration Hurdles For Analog And RF In Next-Gen Packages
By Gregory Haley - 23 May, 2024 - Comments: 0

A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package. Since the early 2000s, the majority of chips used at the most advanced nodes were systems-on-chip (SoCs). All features had to fit into a single planar S... » read more

Compilation Challenges Of Scaling Up Quantum Computing With Superconducting Chiplet Architecture
By Technical Paper Link - 21 May, 2024 - Comments: 0

A technical paper titled “MECH: Multi-Entry Communication Highway for Superconducting Quantum Chiplets” was published by researchers at University of California San Diego, University of California Santa Barbara, and Cisco Quantum Lab. Abstract: "Chiplet architecture is an emerging architecture for quantum computing that could significantly increase qubit resources with its great scalabili... » read more

Will Domain-Specific ICs Become Ubiquitous?
By Brian Bailey - 16 May, 2024 - Comments: 0

Questions are surfacing for all types of design, ranging from small microcontrollers to leading-edge chips, over whether domain-specific design will become ubiquitous, or whether it will fall into the historic pattern of customization first, followed by lower-cost, general-purpose components. Custom hardware always has been a double-edged sword. It can provide a competitive edge for chipmake... » read more

SRAM Security Concerns Grow
By Karen Heyman - 09 May, 2024 - Comments: 0

SRAM security concerns are intensifying as a combination of new and existing techniques allow hackers to tap into data for longer periods of time after a device is powered down. This is particularly alarming as the leading edge of design shifts from planar SoCs to heterogeneous systems in package, such as those used in AI or edge processing, where chiplets frequently have their own memory hi... » read more

Overcoming Chiplet Integration Challenges With Adaptability
By Jayson Bethurem - 09 May, 2024 - Comments: 0

Chiplets are exploding in popularity due to key benefits such as lower cost, lower power, higher performance and greater flexibility to meet specific market requirements. More importantly, chiplets can reduce time-to-market, thus decreasing time-to-revenue! Heterogeneous and modular SoC design can accelerate innovation and adaptation for many companies. What’s not to like about chiplets? Well... » read more

UCIe And Automotive Electronics: Pioneering The Chiplet Revolution
By Vinod Khera - 09 May, 2024 - Comments: 0

The automotive industry stands at the brink of a profound transformation fueled by the relentless march of technological innovation. Gone are the days of the traditional, one-size-fits-all system-on-chip (SoC) design framework. Today, we are witnessing a paradigm shift towards a more modular approach that utilizes diverse chiplets, each optimized for specific functionalities. This evolution pro... » read more

Adapting To Evolving IC Requirements
By Ed Sperling - 07 May, 2024 - Comments: 0

As chip designs become increasingly heterogeneous and domain-specific, packing a device with one-size-fits-all chips or chiplets doesn't make sense. The key is rightsizing different components based on real workloads, so they don't waste power when there is too little utilization of logic, and so they don't struggle to complete tasks because they are undersized. Jayson Bethurem, vice president ... » read more

Sensor Fusion Challenges In Automotive
By Ed Sperling - 02 May, 2024 - Comments: 0

The number of sensors in automobiles is growing rapidly alongside new safety features and increasing levels of autonomy. The challenge is integrating them in a way that makes sense, because these sensors are optimized for different types of data, sometimes with different resolution requirements even for the same type of data, and frequently with very different latency, power consumption, and re... » read more

EDA Looks Beyond Chips
By Ed Sperling - 25 Apr, 2024 - Comments: 0

Large EDA companies are looking at huge new opportunities that reach well beyond semiconductors, combining large-scale multi-physics simulations with methodologies and tools that were developed for chips. Top EDA executives have been talking about expanding into adjacent markets for more than a decade, but the broader markets were largely closed to them. In fact, the only significant step in... » read more

The 3D-IC Multiphysics Challenge Dictates A Shift-Left Strategy
By John Ferguson - 25 Apr, 2024 - Comments: 0

As the industry marches forward in a 3D-IC centric design approach (figure 1), we are facing a new problem. Sometimes referred to as “electro-thermal” or “electro-thermo-mechanical,” it really is the confluence of multiple forms of physics exerting impacts on both the physical manufacture and structure of these multi-die designs and their electrical behavior. Fig. 1: Illustration... » read more

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