tag: cloud

Tradeoffs Between Edge Vs. Cloud
By Brian Bailey - 09 Sep, 2021 - Comments: 0

Increasing amounts of processing are being done on the edge, but how the balance will change between what's computed in the cloud versus the edge remains unclear. The answer may depend as much on the value of data and other commercial reasons as on technical limitations. The pendulum has been swinging between doing all processing in the cloud to doing increasing amounts of processing at the ... » read more

Best Practices For Deploying Cliosoft SOS On AWS
By Cliosoft - 01 Sep, 2021 - Comments: 0

Semiconductor Integrated Circuits (ICs) are at the center of a number of modern technological innovations. To keep up with the ever-increasing pace of innovation, IC design teams require robust, scalable design management (DM) solutions to enable seamless global collaboration and increase productivity. This eBook outlines the advantages of, and best practices, for deploying Cliosoft SOS design ... » read more

Connecting Teams With A Collaboration Hub In The Cloud
By Siemens EDA - 25 Aug, 2021 - Comments: 0

Given the complexities inherent in both next-generation products and the underlying components used, effective collaboration is fundamental to successfully navigating the product creation journey. Teams that are better synchronized and aligned are far more likely to deliver a successful product to market on time and on budget. Explore how the Connect application extends the power of PADS Pro... » read more

Challenges For New AI Processor Architectures
By Brian Bailey - 29 Jul, 2021 - Comments: 0

Investment money is flooding into the development of new AI processors for the data center, but the problems here are unique, the results are unpredictable, and the competition has deep pockets and very sticky products. The biggest issue may be insufficient data about the end market. When designing a new AI processor, every design team has to answer one fundamental question — how much flex... » read more

Sensor Fusion Everywhere
By Ed Sperling - 19 Jul, 2021 - Comments: 0

How do you distinguish between background noise and the sound of an intruder breaking glass? David Jones, head of marketing and business development for intuitive sensing solutions at Infineon, looks at what types of sensors are being developed, what happens when different sensors are combined, what those sensors are being used for today, and what they will be used for in the future. » read more

Safe And Robust Machine Learning
By Ed Sperling - 15 Jul, 2021 - Comments: 0

Deploying machine learning in the real world is a lot different than developing and testing it in a lab. Quenton Hall, AI systems architect at Xilinx, examines security implications on both the inferencing and training side, the potential for disruptions to accuracy, and how accessible these models and algorithms will be when they are used at the edge and in the cloud. This involves everything ... » read more

CEO Outlook: Chiplets, Longer IC Lifetimes, More End Markets
By Ed Sperling - 14 Jul, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, longer IC lifetimes, and a spike in the number of end applications with Lip-Bu Tan, CEO of Cadence; Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of Siemens IC EDA; John Kibarian, CEO of PDF Solutions; Prakash Narain, president and CEO of Real Intent; Dean Drako, president and CEO of IC Manage; an... » read more

Getting Realistic About AI
By Olaf Enge-Rosenblatt - 12 Jul, 2021 - Comments: 0

By Olaf Enge-Rosenblatt and Andy Heinig The topic of artificial intelligence (AI) is omnipresent today, both in the news and on popular science shows. The number of possibilities for AI methods to assist people in making decisions are expanding rapidly. There are three main reasons for this: The development of new AI methods (deep learning, reinforcement learning); The continuous ... » read more

An Advanced Infrastructure To Enable Secure, Cloud-Aware Design And Processed Data EDA Tool Interoperability
By Si2 - 22 Jun, 2021 - Comments: 0

By Rajeev Jain, Kerim Kalafala, and Ramond Rodriguez Significant technology disruptions are on the horizon that will provide massive efficiency gains for EDA tool suppliers and semiconductor companies alike. These disruptions include the application of artificial intelligence and machine learning to enhance supplier tools and optimize user design flows and methodologies, and the ensuing migr... » read more

Customizing Chips For Power And Performance
By Ed Sperling - 10 Jun, 2021 - Comments: 0

Sandro Cerato, senior vice president and CTO of the Power & Sensor Systems Business Unit at Infineon Technologies, sat down with Semiconductor Engineering to talk about fundamental shifts in chip design with the rollout of the edge, AI, and more customized solutions. What follows are excerpts of that conversation. SE: The chip market is starting to fall into three distinct buckets, the e... » read more

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