Power/Performance Bits: March 27


Equalizing batteries Engineers at the University of Toledo propose a bilevel equalizer technology to improve the life span of batteries by combining the high performance of an active equalizer with the low cost of a passive equalizer. "Whenever we are talking about batteries, we are talking about cells connected in a series. Over time, the battery is not balanced and limited by the weakest ... » read more

Trump Wants Critical Metals


In recent times, President Trump has taken an active role in the electronics and related sectors, notably the U.S. administration’s move to block Broadcom’s unsolicited, $117 billion takeover bid for Qualcomm. The Trump administration has also raised eyebrows by blocking other deals as well. And with little or no fanfare, the administration is also taking a role in another area—critica... » read more

Executive Insight: Wally Rhines (March 2018)


Wally Rhines, president and CEO of [getentity id="22017" e_name="Mentor, a Siemens Business"], sat down with Semiconductor Engineering to discuss a wide range of industry and technology changes and how that will play out over the next few years. What follows are excerpts of that conversation. SE: What will happen in the end markets? Rhines: The end markets are perhaps more exciting from a... » read more

Tech Talk: 5/3nm Parasitics


Ralph Iverson, principal R&D engineer at Synopsys, talks about parasitic extraction at 5/3nm and what to expect with new materials and gate structures such as gate-all-around FETs and vertical nanowire FETs. https://youtu.be/24C6byQBkuI » read more

Metal Markets In Flux


Markets for critical metals are becoming turbulent, creating shortages and widespread supply chain concerns. Critical metals are the raw elements and materials used in the production of aerospace/defense systems, automobiles, batteries, computers and electronic products. Many critical metals also are scarce, and there is high risk associated with their supply. In a recent report, the Europea... » read more

E-beam Inspection Makes Inroads


E-beam inspection is gaining traction in critical areas in fab production as it is becoming more difficult to find tiny defects with traditional methods at advanced nodes. Applied Materials, ASML/HMI and others are developing new e-beam inspection tools and/or techniques to solve some of the more difficult defect issues in the fab. [gettech id="31057" t_name="E-beam"] inspection is one of tw... » read more

All About Interconnects


It's well known that advanced chips contain billions of transistors – this is an incredible, mind-blowing fact to be sure – but did you know that large-scale integrated chips (about the size of a fingernail) can contain ~30 miles of interconnect “wires” in stacked levels? These wires function like highways or pipelines to transport electrons, connect transistors and other components to ... » read more

Power/Performance Bits: Oct. 31


Battery material supplies Researchers at MIT, the University of California at Berkeley, and the Rochester Institute of Technology conducted an analysis of whether there are enough raw materials to support increased lithium-ion battery production, expected to grow significantly due to electric vehicles and grid-connected battery systems. They conclude that while in the near future there shou... » read more

Ruthenium Liners Give Way To Ruthenium Lines


For several years now, integrated circuit manufacturers have been investigating alternative barrier layer materials for copper interconnects. As interconnect dimensions shrink, the barrier accounts for an increasing fraction of the total line volume. As previously reported, both cobalt and ruthenium have drawn substantial interest because they can serve as both barrier and seed layers, minimizi... » read more

New BEOL/MOL Breakthroughs?


Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

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