Replicating da Vinci’s Aerial Vehicle Design

By Veena Parthan - 07 Apr, 2022 - Comments: 0

Unmanned aerial vehicles (UAVs), the prodigy of remotely piloted vehicles, largely used for military purposes, are slowly gaining momentum in our civil lives. Some of the applications of UAVs go beyond surveillance or photography: we already have drones that are employed by farmers to monitor crops and are used in the solar industry for thermographic studies. By 2026, UAVs for both consumer and... » read more

CFD Playing Increasing Role In Design

By Ann Mutschler - 10 Feb, 2022 - Comments: 0

With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Progress And Challenges On The CFD Vision 2030 Roadmap

By John Chawner - 05 Aug, 2021 - Comments: 0

After a long writing (and longer editing and approval seeking) process, the AIAA's CFD Vision 2030 Integration Committee has published its first update to the Vision's roadmap. This 71 page, thoroughly cited report assesses progress toward the Vision during 2020 and also provides a 5-year look-back. It covers the six domains along which the vision assesses progress in CFD: high performance comp... » read more

Mapping Heat Across A System

By Ann Mutschler - 13 May, 2021 - Comments: 0

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Thermal Challenges In Advanced Packaging

By Ed Sperling - 02 Dec, 2019 - Comments: 2

CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on. Interested in more Semiconductor Engineering videos? Sign-up for our YouTube channel here » read more

Speeding Up Electrical Vehicle Development With Designer-Centric Thermal And Electromagnetic Simulation And Analysis

By Puneet Sinha - 04 Apr, 2019 - Comments: 0

By 2040, 54% of new car sales and 33% of the global car fleet is predicted to be electric [1]. More than six countries have announced a ban on internal-combustion engines. China is expected to be the largest market for electrical vehicles (EVs), which is driving automakers to make aggressive rollout plans for EVs. Some of the important trends driving EV development are getting more than 200 ... » read more

1D-3D CFD And 3D-1D CFD: Simulation Based Characterization

By Mentor, a Siemens Business - 26 Jul, 2017 - Comments: 0

To understand 1D-3D CFD and 3D-1D CFD, we have reviewed the history of attempts at both loose and close coupling of 1D and 3D CFD codes, the motivations of engineers who did it, and the benefits to be gained from these complementary engineering simulation technologies. Not least, because the umbrella term ‘1D/3D’ covers a number of different possible implementations with their own pros and ... » read more

The Democratization Of CFD

By Mentor, a Siemens Business - 26 Apr, 2017 - Comments: 0

“Democratization” is a buzzword that has been circulating around the Computational Fluid Dynamics (CFD) community for some time. In this White Paper, Keith Hanna and Ivo Weinhold of Mentor Graphicsdefine the issue, establish the facts, look at the pros and cons of various technology solutions being offered in the market today, and then suggest some pointers for the future as the CFD industr... » read more

The Best Of Both Worlds

By Ansys - 11 Jan, 2017 - Comments: 0

Fidelity and accuracy are critical in computational fluid dynamics (CFD) simulation. After all, physical prototyping and testing can only be reduced if one can expect accurate simulation results. But up to now, high fidelity, high accuracy results have come with a price. Complex, realistic geometries have required hours of manual effort to clean up the model and prepare the mesh. Users have bee... » read more

Controlling Heat

By Ann Mutschler - 12 Sep, 2016 - Comments: 0

Modeling on-chip thermal characteristics and chip-package interactions is becoming much more critical for advanced designs, but how to get there isn't always clear. Every chip, based on its target application, has a thermal design power (TDP) target. This is the typical power it can consume without overreaching the acceptable thermal limits in its intended environment. But in order to rate t... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: computational fluid dynamics