tag: computational fluid dynamics

Mesh Generation And CFD For A Drone’s Coaxial Rotor
By John Chawner - 07 Jul, 2022 - Comments: 0

Our Cadence Channel Partner in Scandinavia, neptech, shares a case study investigating the interaction of a coaxial rotor system and how to optimize its efficiency. Coaxial rotor systems are appealing for multirotor drones, as they increase thrust without increasing the vehicle’s footprint. However, the thrust of a coaxial rotor system is reduced compared to having the rotors in line. It... » read more

Reducing Fuel Consumption By Optimizing Engine Parts With CFD
By Anne-Marie Schelkens - 02 Jun, 2022 - Comments: 0

How to reduce the carbon footprint of the automotive industry? Mobility comes with huge CO2 emissions and drastically reducing them is a top priority of vehicle designers today. It is no surprise that simulation can play a major part in finding solutions for this important challenge. Simulation can provide insight, reduce time-to-market, improve reliability, and reduce engineering cost for ne... » read more

Simulate Rotor Hub Vortex Shedding In Helicopters
By Veena Parthan - 05 May, 2022 - Comments: 0

Although helicopter aerodynamics involves the same forces that arise in airplane aerodynamics, these forces occur differently due to fluid flow dynamics across the aircraft. Helicopters take advantage of the free stream flow along a rotor blade to produce lift and thrust. In rotating systems, the rotor hub clasps the blades and connects them to the main shaft of the system. The rotor in a h... » read more

The Era Of Fluid Simulations In Hollywood
By Veena Parthan - 14 Apr, 2022 - Comments: 0

With the magnificent real images of water pouring from the sky and the after-fire fumes from a car, there is no escaping from the laws of physics in movies either! Fluid simulation in the '50s and '60s was modeled mathematically before the computer graphics industry made its appearance. In the early ’90s, computer graphics (CG) in movies such as Waterworld and Titanic were restricted to wi... » read more

Replicating da Vinci’s Aerial Vehicle Design
By Veena Parthan - 07 Apr, 2022 - Comments: 0

Unmanned aerial vehicles (UAVs), the prodigy of remotely piloted vehicles, largely used for military purposes, are slowly gaining momentum in our civil lives. Some of the applications of UAVs go beyond surveillance or photography: we already have drones that are employed by farmers to monitor crops and are used in the solar industry for thermographic studies. By 2026, UAVs for both consumer and... » read more

CFD Playing Increasing Role In Design
By Ann Mutschler - 10 Feb, 2022 - Comments: 0

With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Progress And Challenges On The CFD Vision 2030 Roadmap
By John Chawner - 05 Aug, 2021 - Comments: 0

After a long writing (and longer editing and approval seeking) process, the AIAA's CFD Vision 2030 Integration Committee has published its first update to the Vision's roadmap. This 71 page, thoroughly cited report assesses progress toward the Vision during 2020 and also provides a 5-year look-back. It covers the six domains along which the vision assesses progress in CFD: high performance comp... » read more

Mapping Heat Across A System
By Ann Mutschler - 13 May, 2021 - Comments: 0

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Thermal Challenges In Advanced Packaging
By Ed Sperling - 02 Dec, 2019 - Comments: 2

CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTube channel here » read more

Speeding Up Electrical Vehicle Development With Designer-Centric Thermal And Electromagnetic Simulation And Analysis
By Puneet Sinha - 04 Apr, 2019 - Comments: 0

By 2040, 54% of new car sales and 33% of the global car fleet is predicted to be electric [1]. More than six countries have announced a ban on internal-combustion engines. China is expected to be the largest market for electrical vehicles (EVs), which is driving automakers to make aggressive rollout plans for EVs. Some of the important trends driving EV development are getting more than 200 ... » read more

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