Thermal Challenges In Advanced Packaging

Understanding transient and static effects in multi-chip configurations.


CT Kao, product management director at Cadence, talks with Semiconductor Engineering about why packaging is so complicated, why power and heat vary with different use cases and over time, and why a realistic power map is essential particularly for AI chips, where some circuits are always on.


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Chris Gintz says:

Are you concerned at all about corrosion caused by fluids used to cool the chips or the wiring harness? Liquids and electrons have a tendency to be a bad solution to the heating/thermal problem.

Michael Mingliang Liu says:

A thermal-aware RTL simulation/analysis flow, anyone!?

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