tag: CXL

Week In Review: Design, Low Power
By Marie C. Baca - 26 Aug, 2022 - Comments: 0

Quantum computing Baidu introduced a 10-qubit quantum computer called Qianshi and what it described as “the world's first all-platform quantum hardware-software integration solution that provides access to various quantum chips via mobile app, PC, and cloud.” The company said it has also completed the design of a 36-qubit quantum chip. Scientists said “levitating” nanoparticles co... » read more

Finding the Scope of CXL-Enabled Tiered Memory System in Production
By Technical Paper Link - 25 Aug, 2022 - Comments: 0

This new technical paper titled "TPP: Transparent Page Placement for CXL-Enabled Tiered Memory" is presented by researchers at University of Michigan and Meta Inc. Abstract (partial) "We propose a novel OS-level application-transparent page placement mechanism (TPP) for efficient memory management. TPP employs a lightweight mechanism to identify and place hot and cold pages to appropriate... » read more

Compute Express Link (CXL): All You Need To Know
By Rambus - 10 Aug, 2022 - Comments: 0

An in-depth look at Compute Express Link  (CXL) 2.0, an open standard cache-coherent interconnect between processors and accelerators, smart NICs, and memory devices. We explore how CXL is helping data centers more efficiently handle the yottabytes of data generated by artificial intelligence (AI) and machine learning (ML) applications. We discuss how CXL technology maintains memory c... » read more

Research Bits: July 18
By Jesse Allen - 18 Jul, 2022 - Comments: 0

CXL memory disaggregation Researchers from the Korea Advanced Institute of Science and Technology (KAIST) developed a Compute Express Link (CXL) solution for directly accessible, high-performance memory disaggregation that they say significantly improves performance compared to existing remote direct memory access (RDMA)-based memory disaggregation. RDMA enables a host to directly access an... » read more

What Future Processors Will Look Like
By Ed Sperling - 13 Jul, 2022 - Comments: 0

Mark Papermaster, CTO at AMD, sat down with Semiconductor Engineering to talk about architectural changes that are required as the benefits of scaling decrease, including chiplets, new standards for heterogeneous integration, and different types of memory. What follows are excerpts of that conversation. SE: What does a processor look like in five years? Is it a bunch of chips in a package? I... » read more

Standardizing Chiplet Interconnects
By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

DRAM Choices Becoming Central Design Considerations
By Ann Mutschler - 12 May, 2022 - Comments: 0

Chipmakers are paying much closer attention to various DRAM options as they grapple with what goes on-chip or into a package, elevating attached memory to a critical design element that can affect system performance, power, and cost. These are increasingly important issues to sort through with a number of tradeoffs, but the general consensus is that to reach the higher levels of performance ... » read more

Rambus To Buy Hardent
By Ed Sperling - 05 May, 2022 - Comments: 0

Rambus inked a deal to buy Hardent, an engineering services company, in order to accelerate Rambus' push into the CXL arena. Compute Express Link (CXL), developed primarily by Intel before being turned into an open industry standard, allows memory to be disaggregated within a data center and shared across multiple servers. This, in turn, lets data centers control how critical resources are a... » read more

Interop Shift Left: Using Pre-Silicon Simulation for Emerging Standards
By Cadence - 13 Apr, 2022 - Comments: 0

By Martin James, Gary Dick, and Arif Khan, Cadence with Suhas Pai and Brian Rea, Intel The Compute Express Link™ (CXL™) 2.0 specification, released in 2020, accompanies the latest PCI Express (PCIe) 5.0 specification to provide a path to high-bandwidth, cache-coherent, low-latency transport for many high-bandwidth applications such as artificial intelligence, machine learning, ... » read more

Choosing The Right Server Interface Architectures For High Performance Computing
By Jerry Lotto - 12 Apr, 2022 - Comments: 0

The largest bulk and cost of a modern high-performance computing (HPC) installation involves the acquisition or provisioning of many identical systems, interconnected by one or more networks, typically Ethernet and/or InfiniBand. Most HPC experts know that there are many choices between different server manufacturers and the options of form factor, CPU, RAM configuration, out of band management... » read more

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