Complex Chips Make Security More Difficult


Semiconductor supply chain management is becoming more complex with many more moving parts as chips become increasingly disaggregated, making it difficult to ensure where parts originated and whether they have been compromised before they are added into advanced chips or packages. In the past, supply chain concerns largely focused primarily on counterfeit parts or gray-market substitutions u... » read more

Security Risks Grow With 5G


5G mobile phones can download a movie in seconds rather than minutes, but whether that can be done securely remains to be seen. What is clear from technology providers, though, is they are taking security very seriously with this new wireless technology. More data is in motion, and the value of that data is growing as users rely on mobile devices for everything from banking to automotive saf... » read more

TimeCache: Using Time to Eliminate Cache Side Channels when Sharing Software


"Abstract—Timing side channels have been used to extract cryptographic keys and sensitive documents even from trusted enclaves. Specifically, cache side channels created by reuse of shared code or data in the memory hierarchy have been exploited by several known attacks, e.g., evict+reload for recovering an RSA key and Spectre variants for leaking speculatively loaded data. In this paper, we ... » read more

Securing AI/ML With A Hardware Root Of Trust


AI/ML (Artificial Intelligence/Machine Learning) is now pervasive across all industries. It contributes to rationalizing and harnessing the enormous amount of information made available by the current massive wave of digitization. Digitization is transforming how business is run and how value is produced using digital technologies. Data, the raw material of AI/ML and deep learning algorithms, i... » read more

Industry Pushes For Fab Tool Security Standards


The semiconductor industry is developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP theft. Two new standards are in the works, which are being formulated under the auspices of the SEMI trade group with leadership from chipmakers and others. Led by Intel and Cimetrix, the first standard deals with malware-free equ... » read more

Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing the sale of its Payments and Ticketing businesses to Visa for $75 million in cash. “With 30 years of experience pushing the envelope in semiconductor design, we look toward a future of continued innovation to carry on our mission of making data faster and safer,” Rambus President and CEO Luc Seraphin said in a statement. “Completing this transa... » read more

Week in Review: IoT, Security, Autos


Products/Services The Networking for Autonomous Vehicles Alliance announces that Marvell Semiconductor is joining the NAV Alliance following its acquisition of Aquantia. Fourteen companies are in the industry organization, including Bosch, Continental, Nvidia, and Volkswagen. “The NAV Alliance is developing the platforms that will create the future of transportation and we believe that Multi... » read more

Week in Review – IoT, Security, Autos


Products/Services Arm TechCon got under way with a series of announcements. Arm is a founding member of the Autonomous Vehicle Computing Consortium, along with General Motors, Toyota Motor, DENSO, Continental, Bosch, NXP Semiconductors, and Nvidia. More information on the consortium is available here. “Imagine a world where vehicles are able to perceive their dynamically changing environment... » read more

Week in Review – IoT, Security, Autos


Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

Week in Review – IoT, Security, Autos


Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

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