tag: CyberOptics

5G Brings New Testing Challenges
By Bryon Moyer - 11 Aug, 2020 - Comments: 0

As 5G nears commercial reality, makers of chips and systems that will support 5G will need to take on the standard burden of characterizing and testing their systems to ensure both performance and regulatory adherence. Millimeter-wave (mmWave) and beamforming capabilities present the biggest testing challenges. “5G is expected to have the extended coverage plus the bandwidth to harness ... » read more

Case Study – Socket Metrology
By CyberOptics - 11 Aug, 2020 - Comments: 0

From hours to seconds, the SQ3000 CMM optimized our customer’s backend inspection and socket metrology cutting cost and increasing yields for their high-volume manufacturing.Our customer was leveraging a Coordinate Measurement Machine (CMM) to handle the intricate measurements required for their socket metrology, semiconductor jigs and mobile phone sensors. Click here to continue reading. » read more

Next Challenge: Parts Per Quadrillion
By Ed Sperling - 29 Jul, 2020 - Comments: 0

Requirements for purity of the materials used in semiconductor manufacturing are being pushed to unprecedented — and increasingly unprovable — levels as demand for reliability in chips over increasingly longer lifetimes continues to rise. And while this may seem like a remote problem for many parts of the supply chain, it can affect everything from availability of materials needed to make t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 Jul, 2020 - Comments: 0

Semicon recap The virtual version of Semicon West took place this week. Virtual events have their places. It’s no substitute for an in-person event. Nonetheless, the virtual version of Semicon West is still a place to get an update on the latest equipment, test and packaging technologies. It is also interesting to visit the virtual booths. It’s a fast way to meet people. I chatted with ... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Jul, 2020 - Comments: 0

Market research After years of falling demand, the PC market is back. The second quarter of 2020 ended well for the traditional PC market, including desktops, notebooks, and workstations. Global PC shipments jumped 11.2% year-over-year reaching a total of 72.3 million units, according to IDC. As restrictions around the world tightened in the first few weeks of the quarter, demand for notebo... » read more

Advanced Packaging Makes Testing More Complex
By Bryon Moyer - 07 Jul, 2020 - Comments: 1

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Jun, 2020 - Comments: 0

Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

Measuring Reflective Surfaces
By Subodh Kulkarni - 15 Jun, 2020 - Comments: 0

Manufacturers are adopting automated optical inspection (AOI) systems based on phase shift profilometry (PSP) for applications in advanced packaging processes. Many of these processes use front end-like techniques to create connections among die within a package and from the packaged die to the outside world. The technique offers fast, precise measurements of the 10µm to 100µm features that a... » read more

Using Fab Sensors To Reduce Auto Defects
By Anne Meixner - 09 Jun, 2020 - Comments: 0

The semiconductor manufacturing ecosystem has begun collaborating on ways to effectively use wafer data to meet the stringent quality and reliability requirements for automotive ICs. Silicon manufacturing companies are now leveraging equipment and inspection monitors to proactively identify impactful defects prior to electrical test. Using machine learning techniques, they combine the monitor ... » read more

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