The Race To Zero Defects In Auto ICs


Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the number of costly returns. Today, assembly defects account for between 12% and 15% of semiconductor customer returns in the automotive chip market. As component counts in vehicles climb from the ... » read more

Deep Learning In Industrial Inspection


Deep learning is at the upper end of AI complexity, sifting through more data to achieve more accurate results. Charlie Zhu, vice president of R&D at CyberOptics, talks about how DL can be utilized with inspection to identify defects in chips that are not discernible by traditional computer vision algorithms, classifying multiple objects simultaneously from multiple angles and taking into accou... » read more

Week In Review: Manufacturing, Test


Acquisitions & Investments California-based MaxLinear plans to acquire Taiwan-based Silicon Motion (SMI), in a cash and stock deal valued at about $3.8 billion. Silicon Motion’s NAND flash controller technology for solid state storage devices, will extend MaxLinear’s RF, analog, and mixed signal portfolio. ISMC will invest about $3 billion in a semiconductor plant in India’s south... » read more

Week In Review: Manufacturing, Test


It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Week In Review: Manufacturing, Test


Onshoring and the supply chain Efforts to patch up supply chain weaknesses by moving more manufacturing onshore in the United States and Europe are generating a lot of buzz. Morris Chang, TMSC's founder, described those moves as "a very expensive exercise in futility," during an interview with the Brookings Institution and Center for Strategic and International Studies, adding that it is like... » read more

Strategies For Faster Yield Ramps On 5nm Chips


Leading chipmakers TSMC and Samsung are producing 5nm devices in high volume production and TSMC is forging ahead with plans for first 3nm silicon by year end. But to meet such aggressive targets, engineers must identify defects and ramp yield faster than before. Getting a handle on EUV stochastic defects — non-repeating patterning defects such as microbridges, broken lines, or missing con... » read more

Case Study — 3D Wire Bond Inspection and Metrology


The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways. CyberOptics addressed the need for an automated solution to replace labor-intensive and imprecise manual inspection methods for wire bonds and loop heights. After consideration of competitive products, ... » read more

Fundamental Shifts In IC Manufacturing Processes


High chip value and 3D packaging are changing where and how tests are performed, tightening design-for-reliability and accelerating the shift of tools from lab to fab. Heterogeneous integration and more domain-specific designs are causing a string of disruptions for chip manufacturers, up-ending proven fab processes and methodologies, extending the time it takes to manufacture a chip, and ul... » read more

Week In Review: Manufacturing, Test


Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing, IoT and 5G Infineon added to its NFC (near-field communications) IP by acquiring NFC patent portfolios from France Brevets and Verimatrix. “With this acquisition, Infineon further strengthens its IP and technology portfolio, specifically in our leadership markets for security and connectivity for the IoT,” said Thomas Rosteck, president of Infineon’s Connected Secure... » read more

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