tag: D2S

Mask Hotspots Are Escaping The Mask Shop
By Various Writers - 16 Apr, 2014 - Comments: 0

Although the overwhelming majority of wafer production issues at the 28nm-and- below process nodes are lithography- and OPC-related, the semiconductor industry is starting to see problems caused by mask hotspots: wafer-level production issues that are caused when the shapes specified by optical proximity correction (OPC) are not faithfully reproduced on the mask. Mask hotspots will account for ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 21 Mar, 2014 - Comments: 0

A market research firm once said if you want to sell a lot of market studies, you have to report big numbers. And some competitors have done just that, according to Will Strauss, president of Forward Concepts. In fact, some research houses inflated their smartphone shipment numbers, saying that the figure reached 1 billion in 2013, Strauss said. So, did 1 billion smartphones really ship last ye... » read more

Directed Self-Assembly Gains Momentum
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

At last year’s SPIE Advanced Lithography symposium, directed self-assembly (DSA) grabbed the spotlight as chipmakers provided the first glimpse of their initial work and results with the technology. The results were stunning, thereby propelling DSA from a curiosity item to a possible patterning solution for next-generation devices. Last year, in fact, GlobalFoundries, IBM, Intel and Sams... » read more

One-on-One: Naoya Hayashi
By Mark LaPedus - 20 Mar, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss the current and future challenges in the photomask industry with Naoya Hayashi, research fellow at Dai Nippon Printing (DNP). SE: What are the big challenges for the photomask industry today? Hayashi: There are several challenges. Most of the challenges involve mask complexity. It is also quite difficult to handle the mask data, because it is ... » read more

Next-Generation Lithography
By Ed Sperling - 04 Mar, 2014 - Comments: 0

Aki Fujimura, CEO of D2S, sat down with Semiconductor Engineering to talk about the challenges of moving to the next process nodes and how that will affect everything from lithography to the write time, size and cost of photomasks. [youtube vid=L96vi-BjhDU] » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Feb, 2014 - Comments: 0

SPIE Advanced Lithography is a patterning show. At the event, however, Applied Materials revealed more details regarding its selective materials removal opportunity, according to Weston Twigg, an analyst with Pacific Crest Securities, in a research note. Applied Materials presented a paper entitled, “Where Is Plasma Etching Going from Here?” “The presenter outlined concepts for thin layer... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 13 Dec, 2013 - Comments: 0

Tensions between the U.S. and China are growing. In a research report, Gus Richard, an analyst at Piper Jaffray, said: “The technology sector is being impacted by U.S./Chinese tensions over cybersecurity. The combination of Huawei being blocked from doing business in the United States and the Snowden affair are impacting U.S. tech companies' prospects in China. China’s state-run media ident... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 06 Dec, 2013 - Comments: 0

A new study reveals that a majority of Americans are making some costly miscalculations regarding the performance of their existing PCs. The survey reveals that Americans lack financial savvy when faced with slow computers. Germany’s Merck KGaA, a pharmaceutical, chemical and life science company, announced an agreement with AZ Electronic Materials, under which Merck KGaA would acquire AZ.... » read more

Why does EUV matter?
By Brian Bailey - 01 Oct, 2013 - Comments: 0

By Brian Bailey The end of Moore’s Law has been predicted for almost as long as the law has existed. It normally comes down to some great technological barrier that cannot be breached, only to find that a solution is just around the corner and the concerns fade until the next barrier is identified. At DAC this year (2013), there were many predictions about why Moore’s Law will end in th... » read more

Mask Data Prep Issues Compounding At 20nm
By Ann Mutschler - 19 Sep, 2013 - Comments: 0

By Ann Steffora Mutschler When it comes to mask data prep—the step in the design and manufacturing flow that occurs just after optical proximity correction (OPC)—challenges have continued to rise with the subsequent moves to smaller geometries. This is driven by the scaling demands of delivering about a 50% area shrink from node to node on a two-year cycle, and thus dictates the lithog... » read more

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