tag: DARPA

The Chiplet Race Begins
By Mark LaPedus - 06 Aug, 2018 - Comments: 1

Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges in the market. A group led by DARPA, as well as Marvell, zGlue and others are pursuing chiplet technology, which is a different way of integrating multiple dies in a package or system. In fact, the Defense Advanced Research Projects Agency (DARPA), part... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Jul, 2018 - Comments: 0

Trade issues China and the United States are embroiled in a trade war. What is the impact? In testimony submitted to the Office of the United States Trade Representative (USTR) on the proposed tariffs on Chinese products, Consumer Technology Association (CTA) Vice President of International Trade Sage Chandler argues tariffs negatively impact businesses and consumers as well as fail to corr... » read more

The Future Is Bright: DARPA Is Driving Electronic Resurgence
By Frank Schirrmeister - 26 Jul, 2018 - Comments: 0

This week, DARPA ran the Electronics Resurgence Initiative (ERI) Summit in San Francisco, and while we are certainly staring at some daunting challenges to continue the fast-paced development in electronics, it looks like the future actually looks quite bright. I found myself whistling, “How lucky we are to be alive right now” from Lin-Manuel Miranda’s Hamilton when leaving the stunning P... » read more

Still Waiting For Autonomous Vehicles
By Robert Vamosi - 09 Jul, 2018 - Comments: 0

To better understand the challenges ahead for fully autonomous vehicles, research teams over the last few decades have attempted to automate the process of driving. But early successes have not yet given us truly autonomous vehicles. Why? The Defense Advanced Research Projects Agency (DARPA) created the first autonomous vehicle in 1984. This limited-use autonomous vehicle could drive on- and... » read more

Advanced Packaging Confusion
By Ed Sperling - 13 Jun, 2018 - Comments: 2

Advanced packaging is exploding in all directions. There are more chipmakers utilizing different packaging options, more options for the packages themselves, and a confusing array of descriptions and names being used for all of these. Several years ago, there were basically two options on the table, 3D-ICs and 2.5D. But as chipmakers began understanding the difficulty, cost and reduced benef... » read more

Syntiant: Analog Deep Learning Chips
By Kevin Fogarty - 12 Jun, 2018 - Comments: 1

Startup Syntiant Corp. is an Irvine, Calif. semiconductor company led by former top Broadcom engineers with experience in both innovative design and in producing chips designed to be produced in the billions, according to company CEO Kurt Busch. The chip they’ll be building is an inference accelerator designed to run deep-learning processes 50x more efficiently than traditional stored-prog... » read more

Tech Talk: ISO 26262 Drilldown
By Ed Sperling - 06 Jun, 2018 - Comments: 0

ArterisIP’s Kurt Shuler looks at what can go wrong in automotive design, what are the prerequisites for getting the attention of Tier 1 and OEMs, and what’s involved in automotive design at all levels. https://youtu.be/nnjAldn-nKU » read more

Progress And Chaos On Road To Autonomy
By Jeff Dorsch - 03 Jun, 2018 - Comments: 1

Progress in the development of fully autonomous vehicles is incremental and slow, but not for lack of effort. Research and development in self-driving cars is under way all around the globe, from the biggest automotive manufacturers and their Tier 1 suppliers to companies not traditionally involved in the automotive industry. Add to that fleets of startups working on sensor technologies and ... » read more

Power/Performance Bits: May 15
By Jesse Allen - 15 May, 2018 - Comments: 0

Aluminum battery materials Scientists from ETH Zurich and Empa identified two new materials that could boost the development of aluminum batteries, a potential low cost, materially abundant option for temporary storage of renewable energy. The first is a corrosion-resistant material for the conductive parts of the battery; the second is a novel material for the battery's positive pole that ... » read more

The Case For Chiplets
By Ed Sperling - 07 May, 2018 - Comments: 4

Discussion about chiplets is growing as the cost of developing chips at 10/7nm and beyond passes well beyond the capabilities of many chipmakers. Estimates for developing 5nm chips (the equivalent 3nm for TSMC and Samsung) are well into the hundreds of millions of dollars just for the NRE costs alone. Masks costs will be in the double-digit millions of dollars even with EUV. And that's assum... » read more

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