New Imaging Tech Finds Buried Defects

By Shinsuke Mizuno - 23 May, 2019 - Comments: 0

By Shinsuke Mizuno and Vadim Kuchik Defects and contamination on the wafer can slow process development times and limit performance and yield. As chips get more complex, more defects can become buried within the increasing number of layers in the design. Finding and analyzing these buried defects is a major challenge for the industry, especially during the early learning cycles of new manufa... » read more

Breakthrough For Scan Diagnosis With Machine Learning

By Matthew Knowles - 07 May, 2019 - Comments: 0

Cell-aware diagnosis is a new and effective way to detect defects inside standard cells. Industry standard failure analysis (FA) results from a major foundry show that cell-aware diagnosis is very effective at increasing the resolution of the diagnosis by reducing the number of suspects in cell-internal defect data. With advanced technology nodes, we have more complex layout structures and f... » read more

Gaps Emerge In Automotive Test

By Ed Sperling - 07 May, 2019 - Comments: 1

Demands by automakers for zero defects over 18 years are colliding with real-world limitations of testing complex circuitry and interactions, and they are exposing a fundamental disconnect between mechanical and electronic expectations that could be very expensive to fix. This is especially apparent at leading-edge nodes, where much of the logic is being developed for AI systems and image se... » read more

Making AI More Dependable

By Ed Sperling - 07 May, 2019 - Comments: 0

Ira Leventhal, vice president of Advantest’s new concept product initiative, looks at why AI has taken so long to get going, what role it will play in improving the reliability of all chips, and how to use AI to improve the reliability of AI chips themselves. » read more

E-Beam Review And CD Measurement Revolutionizes Display Yield Management

By Applied Materials - 20 Mar, 2019 - Comments: 0

Fundamental changes are occurring in the display industry, driven by demands for higher-resolution screens and other capabilities for both mobile and TV applications. To meet these demands, the display technology roadmap in this article calls for innovations in materials, processes and device technology. Critical requirements include smaller design rules and the adoption of a range of materi... » read more

The 3 Main Obstacles To Zero DPPM And How To Overcome Them

By Randy Hierbaum - 12 Mar, 2019 - Comments: 0

As we all well know, there are multiple mission critical applications in today’s “Age of Smart” that are calling for zero DPPM (defective parts per million) in semiconductors and electronic systems. In industries such as automotive, medical, aerospace, and more, where lives are at stake, defective parts are not an option. The quality imperative However, with the ever-growing complexi... » read more

Finding Defects In Chips With Machine Learning

By Mark LaPedus - 12 Mar, 2019 - Comments: 7

Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine learning to help solve the problem. A subset of artificial intelligence (AI), machine learning has been used in computing and other fields for decades. In fact, early forms of machine learning ha... » read more

Using Sensor Data To Improve Yield And Uptime

By Ed Sperling - 21 Feb, 2019 - Comments: 2

Semiconductor equipment vendors are starting to add more sensors into their tools in an effort to improve fab uptime and wafer yield, and to reduce cost of ownership and chip failures. Massive amounts of data gleaned from those tools is expected to provide far more detail than in the past about multiple types and sources of variation, including when and where that variation occurred and how,... » read more

Using CAA And DFM Scoring To Improve Manufacturing Success

By Mentor, a Siemens Business - 26 Sep, 2018 - Comments: 0

Critical area analysis and design for manufacturing scoring both offer designers actionable information they can use to improve their designs to prevent low-yield issues in the foundry. At the same time, they provide the foundry with information they can use for process improvement. Learn how fabless designers, foundries, and integrated device manufacturers can all benefit from addressing manuf... » read more

Chipping Away At Functional Safety Flaws In Automotive Electronics

By Ansys - 17 Sep, 2018 - Comments: 0

Today’s automobiles are packed with electronics. From autonomous driving support and infotainment systems to mission-critical functions like braking, a car’s performance depends on the reliability of these electronics systems. While the semiconductors that lie at the heart of these systems have been not been a focus in the past, today their reliability is coming under closer scrutiny by bot... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: defects