Model-Based Double-Dipole Lithography For Sub-30nm Node Device

By Various Writers - 26 Jun, 2012 - Comments: 0

As the optical lithography advances into the sub-30nm technology node, the various candidates of lithography have been discussed. Double dipole lithography (DDL) has been a primary lithography candidate due to the advantages of a simpler process and a lower mask cost compared to the double patterning lithography (DPL). However, new DDL requirements have been also emerged to improve the process ... » read more

Getting Ready For 20nm

By Ed Sperling - 29 May, 2012 - Comments: 0

By Ed Sperling and Mark Lapedus Despite hurdles in getting 28nm rolling and predictions that process technology will stick around for years to come, there appears to be rapidly growing interest in 20nm—at least from the design side. This is significant for a couple reasons. First, for most companies 20nm will be the first encounter with double patterning because EUV still is not viable—... » read more

Anchors Away – Anchoring and Seeding in Double Pattern Design.

By David Abercrombie - 02 May, 2012 - Comments: 0

David Abercrombie Many aspects of how double patterning (DP) affects the designer depend on the methodology used and the level of control the designer wants. One extreme in methodology and control is full two-layer design, in which the designer decomposes the entire design and tapes out two masks. The designer has complete control of the coloring, but all the responsibility and work as well. T... » read more

Colorblind—Colorless versus Two-Color Double Patterning Design

By David Abercrombie - 05 Mar, 2012 - Comments: 0

By David Abercrombie People are always asking “What should I expect when I start designing at 20nm using double patterning?” It’s a good question, but in many real aspects, the answer is “It depends,” and that is not very satisfying to hear. The way that a designer will interact with the constraints that double patterning (DP) brings is very dependent on the design methodology used. ... » read more

To Cut or Not To Cut? That is the Double Patterning Question

By David Abercrombie - 14 Dec, 2011 - Comments: 1

By David Abercrombie The challenges of double pattering (DP)-based design are looming large to those customers starting to move to the 20 nm technology node. Of course, much of the fear and trepidation is simply due to it being something new to learn, and the sense of risk that a move into the unknown can instill. Regardless of emotions involved, DP does place new restrictions on physical la... » read more

20nm IP Portability Appears Virtually Impossible

By Ed Sperling - 22 Sep, 2011 - Comments: 0

By Ann Steffora Mutschler Each node on the deep submicron path has brought new challenges to engineering teams, and 20nm is no different. With EUV (extreme ultraviolet) lithography challenges still being worked out, double patterning (DP) instead will be embraced in the manufacturing process most likely until 10nm. Due to the unique nature of DP, IP portability between foundries will become a ... » read more

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tag: double patterning

Model-Based Double-Dipole Lithography For Sub-30nm Node Device

Getting Ready For 20nm

Anchors Away – Anchoring and Seeding in Double Pattern Design.

Colorblind—Colorless versus Two-Color Double Patterning Design

To Cut or Not To Cut? That is the Double Patterning Question

20nm IP Portability Appears Virtually Impossible

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