Sorting Out Next-Gen Memory

By Mark LaPedus - 22 Sep, 2016 - Comments: 8

In the data center and related environments, high-end systems are struggling to keep pace with the growing demands in data processing. There are several bottlenecks in these systems, but one segment that continues to receive an inordinate amount of attention, if not part of the blame, is the memory and storage hierarchy. [getkc id="92" kc_name="SRAM"], the first tier of this hierarchy, is... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 12 Aug, 2016 - Comments: 0

Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

May The Cheapest Memory Win

By Ed Sperling - 11 Aug, 2016 - Comments: 4

There are a number of new memory types on the horizon. So why are we still using DRAM, SRAM and hard disk drives developed decades ago? The answer is complicated. Memory, whether it’s on-chip static RAM cache or off-chip dynamic RAM—or flash storage or spinning magnetic media—is really a stack of data storage technologies that need to work seamlessly together and with other non-memory ... » read more

The Future Of Memory

By Ed Sperling - 16 Jun, 2016 - Comments: 2

Semiconductor Engineering sat down to discuss future memory with Frank Ferro, senior director of product management for memory and interface IP at [getentity id="22671" e_name="Rambus"]; Marc Greenberg, director of product marketing at [getentity id="22035" e_name="Synopsys"]; and Lisa Minwell, [getentity id="22242" e_name="eSilicon"]'s senior director of [getkc id="43" kc_name="IP"] marketing.... » read more

What Happened To DSA?

By Mark LaPedus - 19 May, 2016 - Comments: 2

Directed self-assembly (DSA) was until recently a rising star in the next-generation lithography (NGL) landscape, but the technology has recently lost some of its luster, if not its momentum. So what happened? Nearly five years ago, an obscure patterning technology called [gettech id="31046" t_name="DSA"] burst onto the scene and began to generate momentum in the industry. At about that t... » read more

2.5D Becomes A Reality

By Ed Sperling - 11 May, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; Rob Aitken, an [getentity id="22186" comment="ARM"] fellow; John Shin, vice president at [getentity id="22903" e_name="Marvell"]; Bill Isaacson, director of ASIC marketing at [getentity id="22242" e_name="eSilicon"]; Frank Ferro, senior di... » read more

Rethinking Main Memory

By Hunglin Hsu - 10 May, 2016 - Comments: 3

With newer, bigger programs and more apps multitasking simultaneously, the answer to making any system run faster, from handheld to super computer, was always just to add more DRAM. . . and more, and more and more. From data centers to wearables, that model no longer works. By offloading the storage of programs to less expensive solid-state drives (SSDs) and only using a small amount of exp... » read more

Why This Roadmap Matters

By Ed Sperling - 05 May, 2016 - Comments: 0

The semiconductor industry is now officially looking beyond PCs and servers, establishing metrics and guidance for existing and developing market segments rather than just focusing on how to get to the next process nodes. The IEEE's International Roadmap for Devices and Systems marks a fundamental shift in the industry. The uncertainty that has ensued ever since the introduction of 3D transi... » read more

High-Bandwidth Memory

By eSilicon - 27 Apr, 2016 - Comments: 0

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. This white paper explains HBM’s value proposition, and how these five companies make... » read more

Rightsizing Challenges Grow

By Ed Sperling - 20 Apr, 2016 - Comments: 0

Rightsizing chip architectures is getting much more complicated. There are more options to choose from, more potential bottlenecks, and many more choices about what process to use at what process node and for which markets and price points. Rightsizing is a way of targeting chips to specific application needs, supplying sufficient performance while minimizing power and cost. It has been a to... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: DRAM