Accelerating Innovation With An E-Beam Lithography System

By Al Blais - 23 May, 2024 - Comments: 0

By Al Blais and Johnny Yeap Traditional lithography remains a standard in the industry, providing precision and a relatively cost-effective way to create patterns on the wafer when producing very high volumes of chips. However, cycle times can be long depending on the complexity of the masks that must be made. The emergence of maskless e-beam lithography is providing a complementary path ... » read more

eBeam Initiative Marks Major Milestones Over 15 Years Of Photomasks And Lithography

By Jan Willis - 18 Apr, 2024 - Comments: 0

The eBeam initiative celebrated its 15th anniversary at the recent SPIE Advanced Lithography + Patterning Conference. 130 members of the mask and lithography community attended the annual lunch to mark the milestone. The eBeam Initiative welcomed its 53rd member, FUJIFILM Corporation, having grown from 20 members and advisors at its launch. FUJIFILM is the first company from the chemical supply... » read more

Direct Synthesis of Planar (2D) Micro and Nanopatterned Epitaxial Graphene on SiC

By Technical Paper Link - 28 Jul, 2023 - Comments: 0

A technical paper titled “Direct synthesis of nanopatterned epitaxial graphene on silicon carbide” was published by researchers at University of Technology Sydney, Ludwig-Maxilimians Universität München, Monash University, and Imperial College London. Abstract: "This article introduces a straightforward approach for the direct synthesis of transfer-free, nanopatterned epitaxial graphene... » read more

Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing

By eBeam Initiative - 15 Mar, 2023 - Comments: 0

Published by the eBeam Initiative Member Companies (February 2023), this list of artificial intelligence (AI) systems used by member companies in their semiconductor manufacturing products shows progress. New examples of systems using AI include: image processing and parameter tuning in lithography tool mask metrology system B-SPline Control Point generation tool sem... » read more

Machine Learning Invades IC Production

By Mark LaPedus - 18 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

Where MEMS Can Boldly Go Now

By Jeff Dorsch - 06 Nov, 2017 - Comments: 1

MEMS chips are being designed to go into the human body as biosensors, which will require unique packaging. And as demand grows for assisted and automated driving, MEMS devices also are finding new use cases in automotive electronics, their chief market segment prior to the millennium. Pressure sensors, such as those that monitor the air pressure in tires, remain the biggest type of [getkc i... » read more

Securing Chips During Manufacturing

By Ed Sperling - 07 Jul, 2016 - Comments: 0

David Lam, chairman of Multibeam, sat down with Semiconductor Engineering to talk about how next-gen lithography tools can be used to prevent cyber attacks and counterfeiting of hardware. SE: How did you get into the anti-counterfeiting business? Lam: About three years ago we were working with some customers that were troubled by the counterfeiting problem. We became aware of that sense o... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer