tag: EDA

Design Challenges Increasing For Mixed-Die Packages
By Ann Mutschler - 09 Feb, 2022 - Comments: 0

The entire semiconductor ecosystem is starting to tackle a long list of technology and business changes that will be needed to continue scaling beyond Moore's Law, making heterogeneous combinations of die easier, cheaper, and more predictable. There are a number of benefits to mixing die and putting them together in a modular way. From a design standpoint, this approach provides access to th... » read more

RF/Microwave EDA Software Design Flow Considerations For PA MMIC Design
By Cadence - 09 Feb, 2022 - Comments: 0

In this white paper, a gallium arsenide (GaAs) pseudomorphic high-electron mobility transistor (pHEMT) power amplifier (PA) design approach is examined from a systems perspective. It highlights the design flow and its essential features for most PA design projects by illustrating a simple Class A GaAs pHEMT monolithic microwave IC (MMIC) PA design using Cadence AWR Microwave Office circuit desi... » read more

A New Dimension Of Complexity For IC Design
By Ann Mutschler - 27 Jan, 2022 - Comments: 0

Full 3D designs involving logic-on-logic are still in the tire-kicking stage, but gaps in the tooling already are showing up. This is especially evident with static timing analysis (STA), which is used to validate a design’s timing performance by checking all possible paths for timing violations. STA issues began popping up particularly with the introduction of hybrid bonding, a bumpless p... » read more

Growth Spurred By Negatives
By Brian Bailey - 27 Jan, 2022 - Comments: 0

The success and health of the semiconductor industry is driven by the insatiable appetite for increasingly complex devices that impact every aspect of our lives. The number of design starts for the chips used in those devices drives the EDA industry. But at no point in history have there been as many market segments driving innovation as there are today. Moreover, there is no indication this... » read more

Setting Ground Rules For 3D-IC Designs
By Ed Sperling - 12 Jan, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

The Importance Of Layering Data
By Ed Sperling - 11 Jan, 2022 - Comments: 0

The chip industry generates enormous quantities of data, from design through manufacturing, but much of it is unavailable or incomplete. And even when and where it is available, it is frequently under-utilized. While there has been much work done in terms of establishing traceability and data formats, the cross-pollination of data between companies and between equipment makers at various pro... » read more

Reinventing Traceability
By Arteris - 05 Jan, 2022 - Comments: 0

This paper written by Vincent Thibault of Arteris IP describes semiconductor industry-specific problems with establishing and automating traceability between the disparate systems design teams use for requirements, specification, EDA, software engineering, verification, documentation and support. It proposes and explains the Arteris Harmony Trace solution which: Increases system quality... » read more

Domain-Specific Design Drives EDA Changes
By Ann Mutschler - 03 Jan, 2022 - Comments: 0

The chip design ecosystem is beginning to pivot toward domain-specific architectures, setting off a scramble among tools vendors to simplify and optimize existing tools and methodologies. The move reflects a sharp slowdown in Moore's Law scaling as the best approach for improving performance and reducing power. In its place, chipmakers — which now includes systems companies — are pushing... » read more

Challenges With Stacking Memory On Logic
By Ed Sperling - 22 Dec, 2021 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the changes in design tools and methodologies needed for 3D-ICs, with Sooyong Kim, director and product specialist for 3D-IC at Ansys; Kenneth Larsen, product marketing director at Synopsys; Tony Mastroianni, advanced packaging solutions director at Siemens EDA; and Vinay Patwardhan, product management group director at Cadence... » read more

EDA In The Cloud Is Driving Semiconductor Innovation
By Nebabie Kebebew - 22 Dec, 2021 - Comments: 0

In the past decade, the move towards cloud computing occurred primarily in sectors like finance, retail, and healthcare, with the emergence of leading public cloud vendors such as Amazon Web Services (AWS), Microsoft Azure, Google Cloud Platform, and others accelerating the trend. However, the chip design industry has been slower to adopt cloud computing. In the current highly competitive en... » read more

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