Machine Learning Popularity Grows

By Ann Mutschler - 26 Jul, 2017 - Comments: 1

Machine learning and deep learning are showing a sharp growth trajectory in many industries. Even the semiconductor industry, which generally has resisted this technology, is starting to changing its tune. Both [getkc id="305" kc_name="machine learning"] (ML) and deep learning (DL) have been successfully used for image recognition in autonomous driving, speech recognition in natural langua... » read more

The Future Of MEMS Design: Making MEMS Design More Like CMOS Design

By Christine Dufour - 20 Jul, 2017 - Comments: 0

MEMS-based component suppliers want to rapidly ramp their designs into high-volume production. This demand is driving MEMS suppliers to focus on ways to more efficiently re-use established process steps, stacks or technology platforms. To meet this need, we see the emergence of standard MEMS technology and design platforms similar to those used in CMOS design. The semiconductor industry and ... » read more

Dealing With System-Level Power

By Ann Mutschler - 17 Jul, 2017 - Comments: 1

Analyzing and managing power at the system level is becoming more difficult and more important—and slow to catch on. There are several reasons for this. First, design automation tools have lagged behind an understanding of what needs to be done. Second, modeling languages and standards are still in flux, and what exists today is considered inadequate. And third, while system-level power ha... » read more

Transistor Aging Intensifies At 10/7nm And Below

By Ann Mutschler - 13 Jul, 2017 - Comments: 0

Transistor aging and reliability are becoming much more troublesome for design teams at 10nm and below. Concepts like ‘infant mortality’ and 'bathtub curves' are not new to semiconductor design, but they largely dropped out of sight as methodologies and EDA tools improved. To get past infant mortality, a burn-in process would be done, particularly for memories. And for reliability, which... » read more

Is The IP Industry Healthy?

By Brian Bailey - 13 Jul, 2017 - Comments: 0

The semiconductor industry has been through many changes, each designed to reduce the total cost associated with the design and manufacture of chips. Twenty years ago, most companies had their own fabs and designed all of the circuitry on each chip. Today, only a handful of companies still own a fab and outsourcing design, in the form of intellectual property ([getkc id="43" kc_name="IP"]), has... » read more

Implementing High-Density-Advanced Packaging for OSATs And Foundries

By Mentor, a Siemens Business - 12 Jul, 2017 - Comments: 0

HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. By using common tools that have the integration and functionality needed to operate in both the IC and packaging domains and by developing and deploying process optimized design-kits such as ADK’s and PDKs, OSATs, foundries, and their customers can achieve design, fabri... » read more

EDA, IP Growth Hits Double Digits

By Ed Sperling - 06 Jul, 2017 - Comments: 0

The cloud, advanced packaging and AI/machine learning pushed up EDA and IP revenue to the highest Q1 growth level since 2011. Revenue was up 10.5% year over year to $2.168 billion, compared with $1.962 billion in Q1 2016, according to just-released numbers from the Electronic System Design (ESD) Alliance. The four-quarter moving average increased by 10.6%. The two largest regions, the Americ... » read more

EDA Moves Out Of The Shadows

By Ed Sperling - 29 Jun, 2017 - Comments: 0

EDA has long harbored ambitions that are larger than a piece of silicon. The engineering challenges being solved on a nanometric scale are remarkably similar to ones being solved at a much higher level—architectural design, layout, validation, verification, debug, thermal mapping, and a lot more. The problem, at least until recently, is that it has been difficult to gain a foothold in larg... » read more

Machine Learning Meets IC Design

By Brian Bailey - 29 Jun, 2017 - Comments: 2

Machine Learning (ML) is one of the hot buzzwords these days, but even though EDA deals with big-data types of issues it has not made much progress incorporating ML techniques into EDA tools. Many EDA problems and solutions are statistical in nature, which would suggest a natural fit. So why is it so slow to adopt machine learning technology, while other technology areas such as vision recog... » read more

Hybrid Emulation

By Brian Bailey - 29 Jun, 2017 - Comments: 0

Semiconductor Engineering sat down to discuss the growing usage of hybrid verification approaches with Frank Schirrmeister, senior group director of product management & marketing for [getentity id="22032" e_name="Cadence"]; Russ Klein, program director for pre-silicon debug products at [getentity id="22017" e_name="Mentor, a Siemens Business"]; [getperson id="11027" comment="Phil Moorby"],... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.