Machine Learning Showing Up As Silicon IP


New machine-learning (ML) architectures continue to appear. Up to now, each new offering has been implemented in a chip for sale, to be placed alongside host processors, memory, and other chips on an accelerator board. But over time, more of this technology could be sold as IP that can be integrated into a system-on-chip (SoC). That trend is evident at recent conferences, where an increasing... » read more

The Ethernet Evolution


Ethernet was expected to be long gone by now, but predictions of its demise were decades premature. John Swanson, senior product marketing manager for high-performance computing digital IP at Synopsys, talks about how Ethernet has evolved over the past 45 or so years from a somewhat “boring” technology to one that is at the forefront of data center performance improvements, with more update... » read more

Why Data Center Power Will Never Come Down


Data centers have become significant consumers of energy. In order to deal with the proliferation of data centers and the servers within them, there is a big push to reduce the energy consumption of all data center components. With all that effort, will data center power really come down? The answer is no, despite huge improvements in energy efficiency. “Keeping data center power consum... » read more

More Manufacturing Issues, More Testing


Douglas Lefever, CEO of Advantest America, sat down with Semiconductor Engineering to talk about changes in test, the impact of advanced packaging, and business changes that are happening across the flow. What follows are excerpts of that discussion. SE: What are the big changes ahead in test? Lefever: It's less about inflection points and more like moving from algebra to calculus in the ... » read more

Hybrid architecture based on two-dimensional memristor crossbar array and CMOS integrated circuit for edge computing


Abstract "The fabrication of integrated circuits (ICs) employing two-dimensional (2D) materials is a major goal of semiconductor industry for the next decade, as it may allow the extension of the Moore’s law, aids in in-memory computing and enables the fabrication of advanced devices beyond conventional complementary metal-oxide-semiconductor (CMOS) technology. However, most circuital demons... » read more

Evaluation of Thermal Imaging on Embedded GPU Platforms for Application in Vehicular Assistance Systems


Abstract "This study is focused on evaluating the real-time performance of thermal object detection for smart and safe vehicular systems by deploying the trained networks on GPU & single-board EDGE-GPU computing platforms for onboard automotive sensor suite testing. A novel large-scale thermal dataset comprising of > 35,000 distinct frames is acquired, processed, and open-sourced in challengin... » read more

How Inferencing Differs From Training in Machine Learning Applications


Machine learning (ML)-based approaches to system development employ a fundamentally different style of programming than historically used in computer science. This approach uses example data to train a model to enable the machine to learn how to perform a task. ML training is highly iterative with each new piece of training data generating trillions of operations. The iterative nature of the tr... » read more

Manufacturing Shifts To AI Of Things


AI is being infused into the Internet of Things, setting the stage for significant improvements in manufacturing productivity, improved uptime, and reduced costs — regardless of market segment. The traditional approach to improving manufacturing equipment reliability and efficiency is regular scheduled maintenance. While that is an improvement over just fixing or replacing equipment when i... » read more

Sustainability, Ecosystems, And Consumer Requirements In 2022


Last December, my 2021 outlook focused on "industry transformations" across different verticals. I had referenced a lot of the ongoing transformations in hyperscale computing, aerospace/defense, automotive, and healthcare. 2021 didn't disappoint—most of what I discussed further accelerated pace. For instance, pretty much no booth felt complete at the annual Army AUSA event if they were not... » read more

Next Steps For Panel-Level Packaging


Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

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