tag: ESD Alliance

The Week In Review: Design
By Jesse Allen - 10 Feb, 2017 - Comments: 0

IP Rambus unveiled High Bandwidth Memory (HBM) Gen2 PHY developed for GlobalFoundries' FX-14 ASIC platform. The PHY, targeted at networking and data center applications, is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, for a total bandwidth of 256 GB/s. Omnitek launched a number of new FPGA-based video IPs, including HDMI2.0 Tx and Rx, ... » read more

2017: Tool And Methodology Shifts
By Brian Bailey - 26 Jan, 2017 - Comments: 0

As the markets for semiconductor products evolve, so do the tools that enable automation, optimization and verification. While tools rarely go away, they do bend like plants toward light. Today, it is no longer the mobile phone industry that is defining the direction, but automotive and the Internet of Things (IoT). Both of these markets have very different requirements and each creates their o... » read more

The Week In Review: Design
By Jesse Allen - 06 Jan, 2017 - Comments: 0

IP Arastu Systems uncorked a LPDDR3 DRAM Memory Controller. The controller is fully compliant with JEDEC standard JESD209-3C and supports various power down modes as well as multiple channels with a privilege to configure and manage each channel independently and parameterized data width. CSEM's Bluetooth Low Energy silicon RF IP has been validated as Bluetooth 5 compatible. RF test equip... » read more

EDA, IP Up 7%
By Ed Sperling - 22 Dec, 2016 - Comments: 0

EDA and IP growth increased to $2.094 billion in Q3, a 7% gain over the $1.958 billion reported for the same period in 2015, according to just released data from the Electronic System Design Alliance Market Statistics Service. All geographic regions reported growth last quarter. So did computer-aided engineering, the largest single category, which grew 5.0% to $666.7 million in Q3, up from $... » read more

Designing SoC Power Networks
By Brian Bailey - 11 Aug, 2016 - Comments: 0

Designing a power network for a complex SoC is becoming critical for the success of the product, but most chips are still using old techniques that are ill-suited to the latest fabrication technologies, resulting in an expensive, overdesigned product. Not only is the power network as designed too large, but this has several knock-on effects that impact area, timing and power. In the first pa... » read more

The Week In Review: Design
By Jesse Allen - 01 Jul, 2016 - Comments: 0

Acquisitions Rambus acquired Inphi Corporation's Memory Interconnect Business, along with all its assets. Rambus CEO Ron Black seeks the $90 million cash deal boosting the company's position in the server, networking and data center market. The deal is expected to close during the third quarter of 2016. Numbers EDA and IP revenue increased 4.5% in Q1, a significant increase given the s... » read more

EDA, IP Sales Up
By Ed Sperling - 30 Jun, 2016 - Comments: 0

EDA and IP revenue increased 4.5% in Q1, a significant increase given the semiconductor industry was flat last year and that EDA sales dropped 1.9% in Q4 of 2015. Total sales were $1.962 billion, up from $1.877 in Q1 of 2015. The big surprise, though, was Japan, which grew 12%. Japan's semiconductor business has been in a deep slump for several years. "It's been a long time since we've se... » read more

Uncertainty Rocks Chip Market
By Ed Sperling - 30 Jun, 2016 - Comments: 1

The semiconductor industry is undergoing sweeping changes in every direction, making it far more difficult to figure out which path to take next, when to take it, and how to get there. The next few years will redefine which semiconductor companies emerge as leaders, which ones get pushed down or out or absorbed into other companies, and which markets will be the most lucrative. And that coul... » read more

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