tag: eSilicon

The Hunt For A Low-Power PHY
By Brian Bailey - 17 Apr, 2017 - Comments: 0

Physics has been on the side of chipmakers throughout most of the lifetime of [getkc id="74" comment="Moore's Law"], but when dealing with the world outside the chip, physics is working against them. Pushing data at ever-faster rates through boards and systems consumes increasing amounts of power, but the power budget for chips has not been increasing. Could chips be constrained by their int... » read more

2.5D, FO-WLP Issues Come Into Focus
By Ann Mutschler - 10 Apr, 2017 - Comments: 2

Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

The Great Machine Learning Race
By Ed Sperling - 03 Apr, 2017 - Comments: 2

Processor makers, tools vendors, and packaging houses are racing to position themselves for a role in machine learning, despite the fact that no one is quite sure which architecture is best for this technology or what ultimately will be successful. Rather than dampen investments, the uncertainty is fueling a frenzy. Money is pouring in from all sides. According to a new Moor Insights report,... » read more

HBM Upstages DDR In Bandwidth, Power
By Ann Mutschler - 30 Mar, 2017 - Comments: 1

For graphics, networking, and high performance computing, the latest iteration of high-bandwidth memory (HBM) continues to rise up as a viable contender against conventional DDR, GDDR designs, and other advanced memory architectures such as the Hybrid Memory Cube. [getkc id="276" kc_name="HBM"] enables lower power consumption per I/O and higher bandwidth memory access with a more condensed f... » read more

Custom Chip Verification Issues Grow
By Ann Mutschler - 29 Mar, 2017 - Comments: 0

With the transition to finFETs, design conditions have grown more intense. They now include a wider PVT range and less headroom. As a result, electronic systems for applications such as mobile, consumer, and automotive increasingly are becoming more difficult to design due to the exacting performance requirements of these applications. This is particularly evident in custom design, including... » read more

Biz Talk: ASICs
By Ed Sperling - 27 Mar, 2017 - Comments: 0

eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Mar, 2017 - Comments: 0

Chipmakers China’s IC industry is embarking on a recruitment drive to prepare for the operation of new fabs in 2018, according to TrendForce. “TrendForce’s latest analysis on China’s semiconductor sector reveals that the country’s domestic IC manufacturers are affecting the movement of industry talent worldwide as they continue to aggressively headhunt for senior managers and enginee... » read more

Optimal Memory Strategies: Where HBM2 Fits
By eSilicon - 23 Mar, 2017 - Comments: 0

How are you going to build your next big product? Whether it’s in the networking, wireless, mobile or computing market, you are now increasing the functionality of your product. It needs to be able to do many tasks – fast, at low power, and pack as much functionality into the tiniest area for cost effectiveness. What does this mean for the embedded memory content? It is growing rapidly. ... » read more

What Does An AI Chip Look Like?
By Ed Sperling - 01 Mar, 2017 - Comments: 5

Depending upon your point of reference, artificial intelligence will be the next big thing or it will play a major role in all of the next big things. This explains the frenzy of activity in this sector over the past 18 months. Big companies are paying billions of dollars to acquire startup companies, and even more for R&D. In addition, governments around the globe are pouring additional... » read more

The Week In Review: Design
By Jesse Allen - 24 Feb, 2017 - Comments: 0

M&A ARM made two acquisitions to add the new NarrowBand-IoT (NB-IoT) low power wide area connectivity standard to its designs: Mistbase, founded in 2015 in Sweden, provides a complete NB-IoT physical layer implementation solution, while London-based NextG-Com, founded in 2008, offers a complete layer two and three software stack for NB-IoT. Tools Synopsys released the latest versio... » read more

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