Speaking IoT In Many Languages

By Mike Gianfagna - 26 Mar, 2015 - Comments: 0

Let’s face it, Internet of Things (IoT) is a hot topic. Depending on whom you believe, it’s a $300 billion to $19 trillion market opportunity involving 25 billion to 100 billion devices by 2020. These are all huge numbers – they could make Alan Turing himself dizzy. The sheer size of these numbers means good things for the market in general, and for some companies in the tech sector speci... » read more

Tech Talk: IoT Design Changes

By Ed Sperling - 25 Mar, 2015 - Comments: 0

eSilicon's Lisa Minwell talks with Semiconductor Engineering about what's needed to push Internet of Things designs down to the microwatt range, and how to bridge the gap between what's available today and what's needed for the future. [youtube vid= bk3BgtJnFpg] » read more

From Medical And Wearables To Big Data

By eSilicon - 25 Mar, 2015 - Comments: 0

Whether it’s a tiny always-on medical device or a secure cloud network processing Big Data, the Internet of Things is bringing new challenges to IC design. This white paper provides techniques and IP examples for managing IoT’s power and bandwidth demands. To read more, click here. » read more

The Week In Review: Design/IoT

By Jesse Allen - 27 Feb, 2015 - Comments: 0

Mergers & Acquisitions NXP acquired Quintic’s Bluetooth Low Energy and Wearable businesses, adding BLTE to their low power RF-connectivity portfolio. The team of approximately 65 is expected to join NXP when the deal closes in Q1 2015. Tools Cadence unveiled the integration of Forte's Cynthesizer with their own C-to-Silicon Compiler. The result is the Stratus high-level synthesis... » read more

Partition Lines Growing Fuzzy

By Ed Sperling - 26 Feb, 2015 - Comments: 0

For as long as most semiconductor engineers can remember, chips with discrete functions started out on a printed circuit board, progressed into chip sets when it made sense and eventually were integrated onto the same die. The primary motivations behind this trend were performance and cost—shorter distance, fewer mask layers, less silicon. But this equation has been changing over the past ... » read more

IP Market Booms At Advanced Nodes

By Ann Mutschler - 26 Feb, 2015 - Comments: 0

As [getkc id="81" kc_name="SoC"] design and manufacturing costs rise, system OEMs are wringing as much of that increase as they can from ASIC vendors. The result is that engineering teams on the design and test side are being constrained by budgets at a time when complexity is rising and time-to-market pressures are increasing. At least one segment is benefiting from directly this. Budgetary... » read more

Custom Versus Platform Design

By Ed Sperling - 26 Feb, 2015 - Comments: 0

The increase in [getkc id="81" kc_name="SoC"] complexity is being mirrored by a rise in complexity within the markets that drive demand for those chips. The upshot is that a push toward greater connectivity, lower power and better performance—and all for a minimal cost—has turned the pros and cons for custom design vs. platforms and superchips into a murky decision-making process. For t... » read more

Processor Use Models Evolving

By Ann Mutschler - 26 Feb, 2015 - Comments: 0

Application-specific processing is a very broad category. It includes processors that are tuned for a specific application domain such as vision processing or software-defined radio for high-end wireless, or voice trigger in IoT devices. This category also includes narrowly focused processors optimized for a specific [getkc id="81" kc_name="SoC"], with a specific application within the chip. An... » read more

Postcards From The Edge (Of The Cloud)

By Brian Fuller - 12 Feb, 2015 - Comments: 0

The view from the edge of the cloud is pretty spectacular. Out here, there’s endless possibility. But out here on the edge, there’s turbulence, the cold buffeting swirl of today’s engineering challenges. On the edge, some see the Internet of Things (IoT) stalled. I wrote about this last month. The first wave of IoT devices — especially wearables — has quickly commoditized, driven b... » read more

Blog Review: Feb. 4

By Jesse Allen - 04 Feb, 2015 - Comments: 0

After the Super Bowl, Ansys' Thierry Marchal looks at making football safer through virtual prototyping. Sports concussions are a serious danger for athletes from youths to professionals, and modeling head and brain impacts may lead not only to safer football helmets but a better understanding of how to lower the chance of brain injuries in sports. Synopsys' Ray Varghese continues his series... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

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Partitioning In The Chiplet Era

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by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.