Hybrid Photoresist Capable Of High-Resolution, Positive-Tone EUVL Patterning

A technical paper titled “Vapor-Phase Infiltrated Organic–Inorganic Positive-Tone Hybrid Photoresist for Extreme UV Lithography” was published by researchers at Stony Brook University, Brookhaven National Laboratory, and University of Texas at Dallas. Abstract: "Continuing extreme downscaling of semiconductor devices, essential for high performance and energy efficiency of future microe... » read more

EUVL: Extreme Ultraviolet Lithography Research, Development, And Manufacturing (NIST)

A special paper titled “Report from the Extreme Ultraviolet (EUV) Lithography Working Group Meeting: Current State, Needs, and Path Forwards” was published by researchers at National Institute of Standards and Technology (NIST). Abstract: "This is the report of a hybrid working group meeting held on April 25, 2023, at the National Institute of Standards and Technology (NIST) in Boulder, C... » read more

Attenuated Phase Shift Masks (attPSM) For EUV (Fraunhofer IISB)

New research paper titled "Attenuated phase shift masks: a wild card resolution enhancement for extreme ultraviolet lithography?," from researchers at Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB (Germany). Aim: "We review published research on attenuated phase shift masks (attPSM) for EUV with special emphasis on modeling and fundamental understanding of the ... » read more

EUV Challenges And Unknowns At 3nm and Below

The chip industry is preparing for the next phase of extreme ultraviolet (EUV) lithography at 3nm and beyond, but the challenges and unknowns continue to pile up. In R&D, vendors are working on an assortment of new EUV technologies, such as scanners, resists, and masks. These will be necessary to reach future process nodes, but they are more complex and expensive than the current EUV pro... » read more

Manufacturing Bits: Nov. 9

Open-source EUV resist metrology Paul Scherrer Institute (PSI) has developed an open-source software technology for scanning electron microscopy (SEM) applications. The technology is targeted for EUV resist metrology. The technology, called SMILE (SEM-Measured Image Lines Estimator), is an open source software technology, which characterizes line and space patterns in a SEM. SMILE is used t... » read more

How To Extend Litho Scaling

IC mask [getkc id="80" comment="lithography"] today is sophisticated and complex. It's also a work in progress with a lot of unknowns as the industry struggles to increase productivity while reducing risk. The bulk of the work currently is focused on trying to figure out what would be a practical scheme for patterning lithography that could be used at 10nm and 7nm, said Gandharv Bhatara, Ca... » read more

What If EUV Fails?

It’s the worst kept secret in the industry, but extreme ultraviolet (EUV) lithography will likely miss the 10nm node. So, chipmakers will likely extend and use today’s 193nm immersion lithography down to 10nm. This, of course, will require a complex and expensive multiple patterning scheme. Now, chipmakers are formulating their lithography strategies for 7nm and beyond. As it stands now,... » read more