tag: finite element analysis

Powering Mechanical Simulations: AMD Vs. Intel
By Wim Slagter - 14 Nov, 2024 - Comments: 0

When selecting the right central processing unit (CPU) for optimizing Ansys Mechanical structural finite element analysis (FEA) software performance, there are two major players to consider: Intel and AMD. Both have made significant advancements in recent years, but choosing between them depends on several factors that directly affect simulation speeds, scalability, and overall performance fo... » read more

Cloud Or On-premises? Why Not Both: A Hybrid Approach For Structure Simulation
By Thomas Lejeune - 17 Oct, 2024 - Comments: 0

Faced with large problem sizes and urgent deadlines, it’s not surprising that more and more product development teams are accessing high-performance computing (HPC) resources on the cloud. After all, a cloud computing model enables you to access the most advanced, leading-edge software and hardware on demand. There are no queues or wait times. Users can “dial up” core counts and other set... » read more

Predicting Warpage in Different Types of IC Stacks At Early Stage Of Package Design
By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects" was published by researchers at Siemens EDA, D2S, and Univ. Grenoble Alpes, CEA, Leti. Abstract: "A physics-based multi-scale simulation methodology that analyses die stress variations generated by package fabrication is employed for warpage study. The ... » read more

Revving Up SiC And GaN
By Ann Mutschler - 13 Dec, 2021 - Comments: 0

Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

Computational Software: The Foundation Across Software Disciplines
By Frank Schirrmeister - 30 Jul, 2020 - Comments: 0

You may have seen the term "computational software" more often recently. What are some prominent examples? Why do we in the electronic design automation (EDA) industry have to deal with math in the first place? Wasn't chip design all about drawing polygons at one point? I’m glad you asked! Computational software supports and manages the complexity of fundamental industry trends—hyperscal... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science
By Kim Yess - 10 Sep, 2018 - Comments: 0

Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

Life on the Edge of IoT
By Jeff Miller - 02 Jun, 2016 - Comments: 0

The world on the edge of the IoT provides a rich microcosm to explore. While much of the attention paid to IoT is on big data applications in the cloud or the world of aggregating massive data provided by the real-world edge devices in the wild though cellphones and gateways, the edge devices themselves present a cornucopia of design challenges and exciting applications. Sensors and actuators m... » read more

The Evolving Thermal Landscape
By Ann Mutschler - 16 May, 2016 - Comments: 0

Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it's important to ensure that temperatures don't rise high enough to cause reliability problems, adding too much circuitry to control heat can reduce performance and lower energy efficiency. The most common approach to dealing with these issues is thermal simulation, which requir... » read more

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