MPU Vs. MCU

By Bryon Moyer - 01 Dec, 2020 - Comments: 1

There was a time when microprocessors and microcontrollers were distinct devices. There was never a question as to which one you were dealing with. But changes in the memory architecture have muddied the distinction in modern devices. There are a number of ways in which microprocessors and microcontrollers could possibly be differentiated. But there is no universal agreement as to how that s... » read more

Scaling Up Compute-In-Memory Accelerators

By Katherine Derbyshire - 19 Mar, 2020 - Comments: 3

Researchers are zeroing in on new architectures to boost performance by limiting the movement of data in a device, but this is proving to be much harder than it appears. The argument for memory-based computation is familiar by now. Many important computational workloads involve repetitive operations on large datasets. Moving data from memory to the processing unit and back — the so-called ... » read more

Battling Persistent Hacks At The Flash Level

By Bryon Moyer - 05 Mar, 2020 - Comments: 0

Hardware vendors are beginning to close up security vulnerabilities across a broader range of technology than in the past, a sign that they are taking potential hardware breaches much more seriously. Awareness of security flaws has been growing since the introduction of Meltdown, Spectre and Foreshadow, and more recently, the Cable Haunt attack. The general conclusion among chipmakers is tha... » read more

The MCU Dilemma

By Brian Bailey - 13 Feb, 2020 - Comments: 2

The humble microcontroller is getting squeezed on all sides. While most of the semiconductor industry has been able to take advantage of Moore's Law, the MCU market has faltered because flash memory does not scale beyond 40nm. At the same time, new capabilities such as voice activation and richer sensor networks are requiring inference engines to be integrated for some markets. In others, re... » read more

Non-Volatile Memory Tradeoffs Intensify

By Ann Mutschler - 22 Jan, 2020 - Comments: 0

Non-volatile memory is becoming more complicated at advanced nodes, where price, speed, power and utilization are feeding into some very application-specific tradeoffs about where to place that memory. NVM can be embedded into a chip, or it can be moved off chip with various types of interconnect technology. But that decision is more complicated than it might first appear. It depends on the ... » read more

Simplifying Ultra-Low Power System Design

By Paul Hill - 12 Sep, 2019 - Comments: 0

By Paul Hill and Gordon MacNee With any low-power design, the designer has the choice between choosing low-power components or switching off the power to peripheral devices. When considering the choice of non-volatile flash memories, the designer has these same two options available to them – each of which has its pros and cons from system operation, power consumption and reliability persp... » read more

System Bits: June 25

By Jeff Dorsch - 25 Jun, 2019 - Comments: 0

Supercomputers around the world At last week’s International Supercomputing Conference in Frankfurt, Germany, the 53rd biannual list of the Top500 of the most powerful computing systems in the world was released. Broken out by countries of installation, China has 219 of the world’s 500 fastest supercomputers, compared with 116 in the United States. Ranking by percent of list flops, the ... » read more

Foundries See Growth, New Issues In 2019

By Mark LaPedus - 17 Dec, 2018 - Comments: 0

The silicon foundry business is poised for growth in 2019, although the industry faces several challenges across a number of market segments next year. Generally, foundry vendors saw steady growth in 2018, but many are ending the year on a sour note. Weak demand for Apple’s new iPhone XR and a downturn in the cryptocurrency market have impacted several IC suppliers and foundries, causing t... » read more

3D NAND Flash Wars Begin

By Mark LaPedus - 20 Aug, 2018 - Comments: 0

3D NAND suppliers are gearing up for a new battle amid a period of price and competitive pressures, racing each other to the next technology generations. Competition is intensifying as a new player enters the 3D NAND market—China’s Yangtze Memory Technologies Co. (YMTC). Backed by billions of dollars in funding from the Chinese government, YMTC recently introduced its first 3D NAND techn... » read more

Tech Talk: MCU Memory Options

By Ed Sperling - 17 May, 2018 - Comments: 0

David Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of embedded non-volatile memory versus system in package. https://youtu.be/6KoQTFbFVCo » read more

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Knowledge Centers
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