Blog Review: Feb. 12

By Ed Sperling - 12 Feb, 2020 - Comments: 0

Complexity is growing by process node, by end application, and in each design. The latest crop of blogs points to just how many dependencies and uncertainties exist today, and what the entire supply chain is doing about them. Mentor's Shivani Joshi digs into various types of constraints in PCBs. Cadence's Neelabh Singh examines the complexities of verifying a lane adapter state machine in... » read more

Software In Inference Accelerators

By Ed Sperling - 10 Feb, 2020 - Comments: 0

Geoff Tate, CEO of Flex Logix, talks about the importance of hardware-software co-design for inference accelerators, how that affects performance and power, and what new approaches chipmakers are taking to bring AI chips to market. » read more

Uses, Limits And Questions For FPGAs In Autos

By Ann Mutschler - 06 Feb, 2020 - Comments: 0

Programmable logic in automotive applications is essential, given the parade of almost constant updates and shifts in direction, but exactly where the technology will be used has become a moving target. This isn't entirely surprising in the automotive industry. Carmakers are moving into electrification and increasing levels of automation in fits and starts, sometimes with dramatic swings in ... » read more

Software Is At Least As Important As Hardware For Inference Accelerators

By Geoff Tate - 06 Feb, 2020 - Comments: 0

In articles and conference presentations on Inference Accelerators, the focus is primarily on TOPS (frequency times number of MACs), a little bit on memory (DRAM interfaces and on chip SRAM), very little on interconnect (also very important, but that’s another story) and almost nothing on the software! Without software, the inference accelerator is a rock that does nothing. Software is wha... » read more

Week In Review: Design, Low Power

By Jesse Allen - 31 Jan, 2020 - Comments: 0

Flex Logix uncorked a new EFLX 1K eFPGA core optimized for the needs of customers on TSMC 40nm Ultra Low Power (ULP) and 40nm Low Power (LP) process technologies. It targets customers focused on low cost and power management. Using a cut-down version and the same software of the EFLX 4K, the EFLX 1K Logic core has 368 inputs and 368 outputs with 900 LUT4 equivalent logic capacity. The EFLX 1K D... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 31 Jan, 2020 - Comments: 0

AI/Edge Brewer Science is introducing its first material for permanent bond used in assembling ICs, image sensor devices, and MEMS for devices and packaging that “include low-temperature bonding, extreme chemical resistance, UV or thermal curable bonding process, and no material movement after cure,” according to a press release. The bond is part of the PermaSOL product family. “These hi... » read more

Big Growth Areas: Connectivity, AI, Reliability

By Brian Bailey - 14 Jan, 2020 - Comments: 0

Connectivity and artificial intelligence (AI) will be the biggest drivers for 2020, with an emphasis on improved reliability across all areas. New standards, new applications, and new pressures being placed on old technology will created boundless opportunities for those ready to fill the need. Of course, there will also be a lot of carnage along the way, and we can expect to see a lot of that ... » read more

Where Is The eFPGA Market And Ecosystem Headed?

By Geoff Tate - 09 Jan, 2020 - Comments: 0

In this article we’ll discuss the availability of eFPGA, the applications for eFPGA and the current and future market size for eFPGA. eFPGA vendors & offerings Embedded FPGA is a new development this decade. There are now multiple vendors offering eFPGA on a wide range of process nodes with multiple customers. eFPGA Vendors Menta has had eFPGA available for the longest: their offe... » read more

Week In Review: Design, Low Power

By Jesse Allen - 13 Dec, 2019 - Comments: 0

Rambus finalized its acquisition of the silicon IP, secure protocols and provisioning business from Verimatrix, formerly Inside Secure, for $45 million at closing, and up to an additional $20 million, subject to certain revenue targets in 2020. RISC-V SiFive unveiled two new product families. The SiFive Apex processor cores target mission-critical processors with Size, Weight, and Power (SW... » read more

Week in Review: IoT, Security and Automotive

By Susan Rambo - 13 Dec, 2019 - Comments: 0

Internet of Things Western Digital Corp. and Codasip are working together on Western Digital’s SweRV Core EH1, which is a RISC-V core with a 32-bit, dual superscalar, 9-stage pipeline architecture. The core, launched earlier this is aimed at embedded devices supporting data-intensive edge applications, such as storage controllers, industrial IoT, real-time analytics in surveillance systems, ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Flex Logix

Blog Review: Feb. 12

Software In Inference Accelerators

Uses, Limits And Questions For FPGAs In Autos

Software Is At Least As Important As Hardware For Inference Accelerators

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Big Growth Areas: Connectivity, AI, Reliability

Where Is The eFPGA Market And Ecosystem Headed?

Week In Review: Design, Low Power

Week in Review: IoT, Security and Automotive