Chip Industry’s Technical Paper Roundup: August 22


New technical papers added to Semiconductor Engineering’s library this week. [table id=129 /]   More Reading Technical Paper Library home » read more

Flexible Hybrid Electronics: Future Standards For Next-Gen 5G/mmWave Wearable and Conformal Applications


A technical paper titled “Additively manufactured flexible on-package phased array antennas for 5G/mmWave wearable and conformal digital twin and massive MIMO applications” was published by researchers at Georgia Institute of Technology. Abstract: "This paper thoroughly investigates material characterization, reliability evaluation, fabrication, and assembly processes of additively manufa... » read more

Chip Industry Technical Paper Roundup: August 15


New technical papers added to Semiconductor Engineering’s library this week. [table id=128 /] More Reading Technical Paper Library home » read more

Week In Review: Auto, Security, Pervasive Computing


Intel issued an advisory of a potential security vulnerability in some of its processors. The company recommends updating to the latest firmware version. NVIDIA unveiled its GH200 Grace Hopper platform, based on 144 Arm Neoverse cores and 282GB of HBM3e memory. Meanwhile, Chinese internet companies including Baidu, ByteDance, Tencent, and Alibaba ordered about $5 billion worth of A800 proces... » read more

A RISC-V Capability Architecture Orchestrating Compiler, Architecture, And System Designs For Full Memory Safety (Georgia Tech, Arm Research)


A technical paper titled “RV-CURE: A RISC-V Capability Architecture for Full Memory Safety” was published by researchers at Georgia Institute of Technology and Arm Research. Abstract: "Despite decades of efforts to resolve, memory safety violations are still persistent and problematic in modern systems. Various defense mechanisms have been proposed, but their deployment in real systems re... » read more

Chip Industry’s Technical Paper Roundup: June 13


New technical papers recently added to Semiconductor Engineering’s library: [table id=109 /] Further Reading Technical Paper Home » read more

3DICs: Legalizer Techniques For Better Routing Quality, Fewer DRVs, And Reduced Total Slack With Negligible Runtime Impact


A technical paper titled “On Legalization of Die Bonding Bumps and Pads for 3D ICs” was published by researchers at the Georgia Institute of Technology, NVIDIA Corporation, and the University of Bremen. Abstract "State-of-the-art 3D IC Place-and-Route flows were designed with older technology nodes and aggressive bonding pitch assumptions. As a result, these flows fail to honor the widt... » read more

Chip Industry’s Technical Paper Roundup: Dec. 5


New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

Research Bits: April 13


Washable battery Researchers from the University of British Columbia developed a washable, flexible, and stretchable battery. “Wearable electronics are a big market and stretchable batteries are essential to their development,” said Dr. Ngoc Tan Nguyen, a postdoctoral fellow at UBC’s faculty of applied science. “However, up until now, stretchable batteries have not been washable. Th... » read more

Power/Performance Bits: Feb. 1


Seaweed-inspired energy harvesting Researchers from Dalian Maritime University, Georgia Institute of Technology, and Sun Yat-sen University developed flexible power generators that mimic the way seaweed sways to efficiently convert surface and underwater waves into electricity to power marine-based devices. Networks of sensors are spread across coastal zones, collecting information on curre... » read more

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