Which Foundry Is In The Lead? It Depends.


The multi-billion-dollar race for foundry leadership is becoming more convoluted and complex, making it difficult to determine which company is in the lead at any time because there are so many factors that need to be weighed. This largely is a reflection of changes in the customer base at the leading edge and the push toward domain-specific designs. In the past, companies like Apple, Google... » read more

Week In Review: Semiconductor Manufacturing, Test


Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

Bump Co-Planarity And Inconsistencies Cause Yield, Reliability Issues


Bumps are a key component in many advanced packages, but at nanoscale levels making sure all those bumps have a consistent height is an increasing challenge. Without co-planarity, surfaces may not properly adhere. That can reduce yield if the problem is not identified in packaging, or it can cause reliability problems in the field. Identifying those issues requires a variety of process steps... » read more

Week In Review: Manufacturing, Test


On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Progress In Quantum Computing


A recent wave of quantum computing investment has given rise to claims of a quantum computing bubble, based on overly optimistic technological claims in a field area that experts say has yet to demonstrate any real utility. But executives on the industry’s front lines say quantum computing is indeed a commercially viable technology, albeit one that is at least several years away from overcomi... » read more

How To Compare Chips


Traditional metrics for semiconductors are becoming much less meaningful in the most advanced designs. The number of transistors packed into a square centimeter only matters if they can be utilized, and performance per watt is irrelevant if sufficient power cannot be delivered to all of the transistors. The consensus across the chip industry is that the cost per transistor is rising at each ... » read more

MicroLEDs Move Toward Commercialization


The market for MicroLED displays is heating up, fueled by a raft of innovations in design and manufacturing that can increase yield and reduce prices, making them competitive with LCD and OLED devices. MicroLED displays are brighter and higher contrast than their predecessors, and they are more efficient. Functional prototypes have been developed for watches, AR glasses, TVs, signage, and au... » read more

Week In Review: Design, Low Power


The U.S. Commerce Department's Bureau of Industry and Security (BIS) issued new export controls on EDA software aimed at designing gate-all-around FETs, which manufacturers plan to implement starting at 3nm (Samsung) and 2nm (Intel and TSMC). Specifically, the ruling controls export of software that is specially designed for implementing RTL to GDSII (or an equivalent standard) for GAA FET desi... » read more

Week in Review: Auto, Security, Pervasive Computing


Automotive and Mobility Lyft launched a new robotaxi service that operates on and around the Las Vegas Strip using the electric Ioniq 5 vehicle from Motional. Similar services by other companies are currently in use in a handful of other U.S. cities, including San Francisco and Phoenix. The new Lyft service currently requires the presence of safety drivers, though Lyft and Motional say it will... » read more

Big Changes In Architectures, Transistors, Materials


Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process steps, increased complexity for each of those steps, and rising costs across the board. At the leading-edge, finFETs will run out of steam somewhere after the 3nm (30 angstrom) node. The three foundries still working at th... » read more

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