tag: GlobalFoundries

New Incentives For Lowering Power
By Ed Sperling - 08 Nov, 2012 - Comments: 0

By Ed Sperling Despite all the focus by design teams on lowering power over the past few years, in many applications power is still the last consideration for many companies in the power-performance-area equation. That’s beginning to change, however, even for applications that in the past have not been particularly power-sensitive. There are several reasons for this shift. No. 1 on the li... » read more

Roundtable: Lower-Power Chips
By Ed Sperling - 08 Nov, 2012 - Comments: 0

Low Power-High Performance Engineering talks about problems in low-power design with Richard Trihy of GlobalFoundries, Leah Clark of Broadcom, Qi Wang of Cadence and Venki Venkatesh of Atrenta. [youtube vid=cD560pgEegk] » read more

Experts At The Table: Obstacles In Low-Power Design
By Ed Sperling - 08 Nov, 2012 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss low-power design with with Leah Clark, associate technical director at Broadcom; Richard Trihy, director of design enablement at GlobalFoundries; Venki Venkatesh, engineering director at Atrenta; and Qi Wang, technical marketing group director at Cadence. What follows are excerpts of that conversation. LPHP: What are ... » read more

Changes Ahead
By Ed Sperling - 17 Oct, 2012 - Comments: 0

Semiconductor Manufacturing & Design talks with GlobalFoundries EVP Mike Noonen about future challenges in IC manufacturing, the future of stacked die and ecosystem challenges ahead. [youtube vid=Wdp9JYvBeSk] » read more

Experts At The Table: IC Manufacturing Challenges
By Ed Sperling - 08 Oct, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future manufacturing challenges with Carlos Mazure, chief technical officer at Soitec; Jeff Hebb, vice president of laser product marketing at Ultratech; Markus Wimplinger, corporate technology development and IP director at EV Group; and Girish Dixit, vice president of the customer integration center and process inte... » read more

ST’s FD-SOI Tech Available to All Through GF
By Various Writers - 08 Oct, 2012 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ In the spring of 2012, STMicroelectronics announced the company would be manufacturing ST-Ericsson’s next-generation (and very successful) NovaThor ARM-based smartphone/tablet processors using 28nm FD-SOI process technology. With first samples coming out this fall, ASN talks to Jean-Marc Chery, Executive Vice Pres... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA
By Various Writers - 25 Sep, 2012 - Comments: 0

The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

DSA: High Stakes Game Of Alphabet Soup
By Ed Sperling - 20 Sep, 2012 - Comments: 0

By Mark LaPedus Directed self-assembly (DSA) is making progress for potential use in semiconductor production, but the industry must make some major advances in a sometimes forgotten and unsung segment—materials. DSA is a complementary patterning technology that makes use of block copolymer materials to enable fine pitches in chip designs. But today’s block copolymers based on poly (MMA... » read more

Experts At The Table: Stacked Die Reality Check
By Ed Sperling - 10 Sep, 2012 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Sunil Patel, principal member of the technical staff for package technology at GlobalFoundries; Steve Pateras, product marketing director at Mentor Graphics; Steve Smith, senior director of platform marketing at Synopsys; Thorsten Matthias, business development director at EVGroup; and Manish Ranjan, vice president of market... » read more

Experts At The Table: Stacked Die Reality Check
By Ed Sperling - 27 Aug, 2012 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Sunil Patel, principal member of the technical staff for package technology at GlobalFoundries; Steve Pateras, product marketing director at Mentor Graphics; Steve Smith, senior director of platform marketing at Synopsys; Thorsten Matthias, business development director at EVGroup; and Manish Ranjan, vice president of market... » read more

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