tag: HBM

Adapting To Broad Shifts Essential In 2022
By Brian Bailey - 21 Dec, 2022 - Comments: 0

Change creates opportunity, but not every company is able to respond quickly enough to take advantage of those opportunities. Others may respond too quickly, before they properly understand the implications. At the start of a typical year, optimism is in plentiful supply. Any positive trend is seen as continuing, and any negative is seen as turning around. Normally the later in the year that... » read more

Boosting Data Center Memory Performance In The Zettabyte Era With HBM3
By Frank Ferro - 08 Dec, 2022 - Comments: 0

We are living in the Zettabyte era, a term first coined by Cisco. Most of the world’s data has been created over the past few years and it is not set to slow down any time soon. Data has become not just big, but enormous! In fact, according to the IDC Global Datasphere 2022-2026 Forecast, the amount of data generated over the next 5 years will be at least 2x the amount of data generated over ... » read more

Systematic Yield Issues Now Top Priority At Advanced Nodes
By Laura Peters - 06 Dec, 2022 - Comments: 0

Systematic yield issues are supplanting random defects as the dominant concern in semiconductor manufacturing at the most advanced process nodes, requiring more time, effort, and cost to achieve sufficient yield. Yield is the ultimate hush hush topic in semiconductor manufacturing, but it's also the most critical because it determines how many chips can be profitably sold. "At older nodes, b... » read more

Cost Characteristics of the 2.5D Chiplet-Based SiP System
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A technical paper titled "Cost-Aware Exploration for Chiplet-Based Architecture with Advanced Packaging Technologies" was published by researchers at UCSB, University of California, Santa Barbara. Abstract: "The chiplet-based System-in-Package~(SiP) technology enables more design flexibility via various inter-chiplet connection and heterogeneous integration. However, it is not known how to ... » read more

Scalable Optical AI Accelerator Based on a Crossbar Architecture
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Scalable Coherent Optical Crossbar Architecture using PCM for AI Acceleration" was published by researchers at University of Washington. Abstract: "Optical computing has been recently proposed as a new compute paradigm to meet the demands of future AI/ML workloads in datacenters and supercomputers. However, proposed implementations so far suffer from lack of sc... » read more

Memory-Based Cyberattacks Become More Complex, Difficult To Detect
By John Koon - 03 Nov, 2022 - Comments: 0

Memories are becoming entry points for cyber attacks, raising concerns about system-level security because memories are nearly ubiquitous in electronics and breaches are difficult to detect. There is no end in sight with hackers taking aim at almost every consumer, industrial, and commercial segment, and a growing number of those devices connected to the internet and to each other. According... » read more

How Memory Design Optimizes System Performance
By John Koon - 21 Sep, 2022 - Comments: 0

Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and packaging, but it also is driving big changes on the memory side. While the underlying technology still looks very familiar, the real shift is in the way those memories are connected to processing elements and various components within a syste... » read more

HBM-based scalable multi-FPGA emulator for Quantum Fourier Transform (QFT)
By Technical Paper Link - 01 Jul, 2022 - Comments: 0

New technical paper titled "A Scalable Emulator for Quantum Fourier Transform Using Multiple-FPGAs With High-Bandwidth-Memory" from researchers at Tohoku University in Japan. Abstract: "Quantum computing is regarded as the future of computing that hopefully provides exponentially large processing power compared to the conventional digital computing. However, current quantum computers do not... » read more

Keeping IC Packages Cool
By Laura Peters and Karen Heyman - 07 Jun, 2022 - Comments: 0

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are wrestling with a whole new set of heat-related issues. The shift to advanced packaging enables chipmakers to meet demands for increasing bandwidth, clock speeds, and power density for high perform... » read more

Standardizing Chiplet Interconnects
By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

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