tag: IEEE

Unraveling Power Methodologies
By Brian Bailey - 15 Jan, 2015 - Comments: 0

When working on articles, the editors at Semiconductor Engineering sometimes hear things that make them stand back and question what seems to be an industry truth. One such statement happened last month while researching a different article. The statement was: Most designs are not top-down, but in fact bottom-up when it comes to power management. The most used methodology today is that the RTL... » read more

Manufacturing Bits: Jan. 6
By Mark LaPedus - 06 Jan, 2015 - Comments: 1

Vertical SiC chips for electric cars Silicon carbide (SiC) is a promising material for power electronics. The material has a high breakdown voltage, high operating temperatures and a superior thermal conductivity. At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, Toyota, the National Institute of Advanced Industrial Science and Technology (AIST) and the... » read more

Manufacturing Bits: Dec. 23
By Mark LaPedus - 23 Dec, 2014 - Comments: 0

Higgs boson sensors At the recent 2014 IEEE International Electron Devices Meeting (IEDM) in San Francisco, CERN described the tiny hybrid pixel detectors used at the Large Hadron Collider (LHC). Using CMOS technology, hybrid pixel detectors identify and tag individual sub-atomic particles at fast speeds. CERN, the European Organization for Nuclear Research, is a particle physics laboratory... » read more

Manufacturing Bits: Sept. 23
By Mark LaPedus - 23 Sep, 2014 - Comments: 0

The annual IEEE International Electron Devices Meeting (IEDM) will take place in San Francisco from Dec. 15-17. As usual, there will be presentations on the latest technologies in a number of fields, such as semiconductors, bio‐sensors, energy harvesting, power devices, sensors, magnetics, spintronics, two-dimensional electronics, among others. Here’s just some of the papers that will be pr... » read more

Who Owns DAC?
By Anne Cirkel - 01 Aug, 2014 - Comments: 4

In June I was chatting with an editor unfamiliar with DAC and he was wondering who owns the conference. It’s a fair question and I recall thinking I’d blog about it as part of my effort to boost understanding of DAC. After all, my goal is to let you glimpse behind the curtain and that means touching on the prosaic though very important issue of ownership. First, the basics. DAC is owne... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 May, 2014 - Comments: 0

GlobalFoundries’ campus in upstate New York employs over 2,200 workers. It is looking to add 600-800 more people by the end of 2014. The company is seeking out engineers with four-year degrees and technicians with associates degrees. It is also bringing in engineers from IBM to ramp its fab in New York. Applied Materials introduced the Endura Ventura PVD system that helps reduce the cost o... » read more

SoC Assembly And IP Reuse
By Kurt Shuler - 24 Apr, 2014 - Comments: 2

I had the honor and opportunity to present at the 2014 Electronic Design Process Symposium in Monterey last Friday. This annual workshop is run by the IEEE Computer Society of Silicon Valley and the IEEE Council on Electronic Design Automation. There were more than 30 participants each day. Most of them very experienced people with lots of technical and business responsibilities. It was ... » read more

Blog Review: April 2
By Ed Sperling - 02 Apr, 2014 - Comments: 0

Mentor’s Nazita Saye compares roadway roundabouts to networked systems. One roundabout works fine, but add in a bunch of them and you have a massive traffic jam. How many roundabouts are in your design? Cadence’s Richard Goering interviews Stan Kroliskoski, chair of the IEEE Design Automation Standards Committee, about four working groups on EDA standards and what’s ahead. Speaking ... » read more

The List Of Unknowns Grows After Silicon
By Katherine Derbyshire - 07 Feb, 2014 - Comments: 3

As discussed earlier in this series, most proposed alternative channel schemes depend on germanium channels for pMOS transistors, and InGaAs channels for nMOS transistors. Of the two materials, InGaAs poses by far the more difficult integration challenges. Germanium has been present in advanced silicon CMOS fabs for several technology generations, having been introduced used in strained silicon... » read more

10 Years Later—Will Project Delays Stop Faster Technology Innovation?
By Frank Schirrmeister - 29 Jan, 2014 - Comments: 0

Every January I enjoy looking back 10 years to learn from the past, consider implications for the future, and have fun picking the worst prediction that did not come true. This year I even can combine my annual trip to the garage where I keep some January issues of IEEE Spectrum with reviewing my own blogging. Five years ago in 2009, I did my first “10-year-lookback” that I called “Bac... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy