tag: IEEE

Where Technology Breakthroughs Are Needed
By Mark LaPedus - 23 Dec, 2019 - Comments: 2

After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help chipmakers migrate to the next nodes. But EUV doesn’t solve every problem. Nor does it address all challenges in the semiconductor industry. Not by a long shot. To be sure, the industry needs... » read more

Week In Review: IoT, Automotive, Security
By Susan Rambo - 20 Dec, 2019 - Comments: 0

Automotive/Mobility Synopsys and Porsche Consulting, a management consultancy that grew out of Porsche’s automotive expertise, have collaborated on a framework for accelerating the development of automotive SoCs, using automotive IP. The process includes Synopsys' Triple Shift-Left — a which uses virtual prototyping and automotive IP to test software and hardware in the design stage — an... » read more

Manufacturing Bits: Dec. 16
By Mark LaPedus - 16 Dec, 2019 - Comments: 0

Imec-Leti alliance At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Leti announced plans to collaborate in select areas. The two R&D organizations plan to collaborate in two areas—artificial intelligence (AI) and quantum computing. Imec and Leti have been separately working on AI technologies based on various next-generation memory architectures. Both entitie... » read more

Extending Portable Stimulus
By Brian Bailey - 16 Oct, 2019 - Comments: 0

It has been a year since Accellera's Portable Test and Stimulus Specification became a standard. Semiconductor Engineering sat down to discuss the impact it has had, and the future direction of it, with Larry Melling, product management director for Cadence; Tom Fitzpatrick, strategic verification architect for Mentor, a Siemens Business; Tom Anderson, technical marketing consultant for OneSpin... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Oct, 2019 - Comments: 0

Fab tools A consortium of 31 companies have launched a new project, called the “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe.” The program is referred to as APPLAUSE. With a budget of 34 million euros, the project is being coordinated by ICOS, a division of KLA. “APPLAUSE will focus on advanced optics, photonics and electronics packagin... » read more

Making Better Use Of Memory In AI
By Ed Sperling - 13 Sep, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks about using number formats to extend memory bandwidth, what the impact can be on fractional precision, how modifications of precision can play into that without sacrificing accuracy, and what role stochastic rounding can play. » read more

Power Modeling Standard Released
By Brian Bailey - 14 Aug, 2019 - Comments: 0

Power is becoming a more important aspect of semiconductor design, but without an industry standard for power models, adoption is likely to be slow and fragmented. That is why Si2 and the IEEE decided to do something about it. Back in 2014, the IEEE expanded its interest in power standards with the creation of two new groups IEEE P2415 - Standard for Unified Hardware Abstraction and Layer fo... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 26 Jul, 2019 - Comments: 0

Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Jul, 2019 - Comments: 0

Si2's Unified Power Model has been approved as IEEE 2416-2019, a new Standard for Power Modeling to Enable System Level Analysis, which complements UPF/IEEE 1801-2018. UPM/IEEE 2416-2019 provides a set of power modeling semantics enabling system designers to model entire systems with flexibility. It supports power modeling from abstract design description to gate level implementation, providing... » read more

System Bits: July 3
By Jeff Dorsch - 03 Jul, 2019 - Comments: 0

CMU prof gets a shot at new supercomputer The National Energy Research Scientific Computing Center will greet its Perlmutter supercomputing system in early 2020. The Cray-designed machine will be capable of 100 million billion floating operations per second. Zachary Ulissi of Carnegie Mellon University will be among the first researchers to use the supercomputer. "When this machine comes on... » read more

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