Week In Review: Semiconductor Manufacturing, Test


This week saw more fallout from U.S. export controls: SK hynix may consider selling its memory chip production facilities in China if recently imposed controls make it too difficult to continue operations there, according to Nikkei Asia. "As a contingency plan, we are considering selling the fab, selling the equipment or transferring the equipment to South Korea," said Kevin Noh, SK hynix ... » read more

Week In Review: Design, Low Power


Tools and IP Scandinavian researchers used a laser-powered chip to transmit about 1.84 petabytes of data over a fiber optic cable in one second. The scientists said the technology could lead to faster broadband speeds and reduce the amount of energy used to keep the internet running. Imec said the semiconductor industry is likely to see increasing separation of power delivery and signal rou... » read more

Which Foundry Is In The Lead? It Depends.


The multi-billion-dollar race for foundry leadership is becoming more convoluted and complex, making it difficult to determine which company is in the lead at any time because there are so many factors that need to be weighed. This largely is a reflection of changes in the customer base at the leading edge and the push toward domain-specific designs. In the past, companies like Apple, Google... » read more

What’s Different About Next-Gen Transistors


After nearly a decade and five major nodes, along with a slew of half-nodes, the semiconductor manufacturing industry will begin transitioning from finFETs to gate-all-around stacked nanosheet transistor architectures at the 3nm technology node. Relative to finFETs, nanosheet transistors deliver more drive current by increasing channel widths in the same circuit footprint. The gate-all-aroun... » read more

Week In Review: Design, Low Power


Tools and IP Renesas introduced a new microprocessor that enables artificial intelligence to process image data from multiple cameras. "One of the challenges for embedded systems developers who want to implement machine learning is to keep up with the latest AI models that are constantly evolving,” said Shigeki Kato, Vice President of Renesas' Enterprise Infrastructure Business Division. �... » read more

DNA Edges Forward As Data Storage Option


At technology conferences back in 2015, scientist David Markowitz raised the idea that DNA could be adapted as a data storage material. The audience response wasn’t all he had hoped for. “They would laugh me off the podium,” Markowitz recalls, but without rancor. Facing skepticism comes with his job at IARPA, the research arm of the U.S. intelligence community. The agency anticipates f... » read more

Progress In Quantum Computing


A recent wave of quantum computing investment has given rise to claims of a quantum computing bubble, based on overly optimistic technological claims in a field area that experts say has yet to demonstrate any real utility. But executives on the industry’s front lines say quantum computing is indeed a commercially viable technology, albeit one that is at least several years away from overcomi... » read more

How To Compare Chips


Traditional metrics for semiconductors are becoming much less meaningful in the most advanced designs. The number of transistors packed into a square centimeter only matters if they can be utilized, and performance per watt is irrelevant if sufficient power cannot be delivered to all of the transistors. The consensus across the chip industry is that the cost per transistor is rising at each ... » read more

The High Price Of Smaller Features


The semiconductor industry’s push for higher numerical apertures is driven by the relationship between NA and critical dimension. As the NA goes up, the CD goes down: Where λ is the wavelength and k1 is a process coefficient. While 0.55 NA exposure systems will improve resolution, Larry Melvin, principal engineer at Synopsys, noted that smaller features always come with a process cos... » read more

Designing For Thermal


Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

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