2D Semiconductors Make Progress, But Slowly

By Katherine Derbyshire - 28 Feb, 2022 - Comments: 2

Researchers are looking at a variety of new materials at future nodes, but progress remains slow. In recent years, 2D semiconductors have emerged as a leading potential solution to the problem of channel control in highly scaled transistors. As devices shrink, the channel thickness should shrink proportionally. Otherwise, the gate capacitance won’t be large enough to control the flow of cu... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 25 Feb, 2022 - Comments: 0

Chipmakers, OEMs UMC plans to build a new fab next to its existing 300mm fab in Singapore. The new fab, called Fab12i P3, will manufacture wafers based on UMC’s 22nm/28nm processes. The planned investment for this project will be $5 billion. The first phase of this greenfield fab will have a monthly capacity of 30,000 wafers with production expected to commence in late 2024. To account fo... » read more

Transistors Reach Tipping Point At 3nm

By Mark LaPedus - 23 Feb, 2022 - Comments: 1

The semiconductor industry is making its first major change in a new transistor type in more than a decade, moving toward a next-generation structure called gate-all-around (GAA) FETs. Although GAA transistors have yet to ship, many industry experts are wondering how long this technology will deliver — and what new architecture will take over from there. Barring major delays, today’s GAA... » read more

Next-Gen 3D Chip/Packaging Race Begins

By Mark LaPedus - 31 Jan, 2022 - Comments: 5

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips usin... » read more

Photomask Challenges At 3nm And Beyond

By Mark LaPedus - 25 Jan, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

An Event-Driven and Fully Synthesizable Architecture for Spiking Neural Networks

By Technical Paper Link - 20 Dec, 2021 - Comments: 0

Abstract: "The development of brain-inspired neuromorphic computing architectures as a paradigm for Artificial Intelligence (AI) at the edge is a candidate solution that can meet strict energy and cost reduction constraints in the Internet of Things (IoT) application areas. Toward this goal, we present μBrain: the first digital yet fully event-driven without clock architecture, with co-lo... » read more

GaN Application Base Widens, Adoption Grows

By Patrick Waurzyniak - 16 Dec, 2021 - Comments: 0

Gallium nitride (GaN) is beginning to show up across a broad range of power semiconductor applications due to its wide bandgap, enabling fast-charging, very high speeds, and much smaller form factors than silicon-based chips. Unlike silicon carbide (SiC), another wide-bandgap technology, GaN is a lateral rather than a vertical device. GaN tops out at about 900 volts, which limits its use in ... » read more

Business, Technology Challenges Increase For Photomasks

By Mark LaPedus - 16 Dec, 2021 - Comments: 0

Manufacturing Bits: Dec. 14

By Mark LaPedus - 14 Dec, 2021 - Comments: 0

3D-SOCs At this week’s IEEE International Electron Devices Meeting (IEDM), a plethora of companies, R&D organizations and universities presented papers on the latest and greatest technologies. One of the themes at IEDM is advanced packaging, a technology enables an IC vendor to boost the performance of a chip. Advanced forms of packaging also enables new 3D-like chip architectures. Fo... » read more

Power/Performance Bits: Nov. 16

By Jesse Allen - 16 Nov, 2021 - Comments: 0

Light-emitting memory Researchers from Kyushu University and National Taiwan Normal University propose a 'light-emitting memory' based on a perovskite that can simultaneously store and visually transmit data. The team used the idea in conjunction with resistive RAM (RRAM), in which states of high and low resistance represent ones and zeros. "The electrical measurements needed to check the r... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: imec

2D Semiconductors Make Progress, But Slowly

Week In Review: Manufacturing, Test

Transistors Reach Tipping Point At 3nm

Next-Gen 3D Chip/Packaging Race Begins

Photomask Challenges At 3nm And Beyond

An Event-Driven and Fully Synthesizable Architecture for Spiking Neural Networks

GaN Application Base Widens, Adoption Grows

Business, Technology Challenges Increase For Photomasks

Manufacturing Bits: Dec. 14

Power/Performance Bits: Nov. 16

Trending Articles

Is In-Memory Compute Still Alive?

Baby Steps Toward 3D DRAM

Chip Industry Week In Review

Chip Industry Week in Review

What’s Next For Through-Silicon Vias

Knowledge Centers
Entities, people and technologies explored